发明公开
EP2290684A1 Method to provide a protective layer on an integrated circuit and integrated circuit fabricated according to said method
审中-公开
提供在集成电路的保护层的方法和集成电路，其是根据该方法制造
- 专利标题： Method to provide a protective layer on an integrated circuit and integrated circuit fabricated according to said method
- 专利标题（中）： 提供在集成电路的保护层的方法和集成电路，其是根据该方法制造
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申请号： EP09169154.3申请日： 2009-09-01
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公开(公告)号： EP2290684A1公开(公告)日： 2011-03-02
- 发明人: De Zaldivar, José Solo , Poole, Philip John
- 申请人： Microdul AG
- 申请人地址： Grubenstrasse 9 8045 Zürich CH
- 专利权人： Microdul AG
- 当前专利权人： Microdul AG
- 当前专利权人地址： Grubenstrasse 9 8045 Zürich CH
- 代理机构： Liebetanz, Michael
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L31/0216 ; H01L23/58
摘要：
A method to provide at least one protective, especially a light-shielding, layer (2) on an integrated circuit (10) applies the protective metal layer (2) as an additional layer to the integrated circuit (10) after completion of the integrated circuit manufacturing step. This allows for an at least partly shielded integrated circuit comprising a protective layer (2,4), wherein the metallic shielding layer (2) and the overlying polyimide layer (4) are patterned with a different, coarser resolution than the other IC metal interconnection layers.
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