发明公开
EP2300355A1 BONDED MICROFLUIDICS SYSTEM COMPRISING CMOS-CONTROLLABLE MICROFLUIDIC DEVICES 审中-公开
与CMOS应税MICRO DEVICES流体保税微流体系统

BONDED MICROFLUIDICS SYSTEM COMPRISING CMOS-CONTROLLABLE MICROFLUIDIC DEVICES
摘要:
A microfluidic system comprising an integrated circuit having a bonding surface bonded to a polymeric microfluidics platform. The microfluidic system comprises one or more microfluidics devices controlled by control circuitry in the integrated circuit. At least one of the microfluidic devices comprises a MEMS actuator positioned in a MEMS layer of the integrated circuit. The MEMS layer is covered with a polymeric layer which defines the bonding surface of the integrated circuit.
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