发明授权
- 专利标题： THERMAL MANAGEMENT FOR DATA MODULES
- 专利标题（中）： 数据模块的热管理
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申请号： EP09751715.5申请日： 2009-05-22
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公开(公告)号： EP2304518B1公开(公告)日： 2018-05-09
- 发明人: RIDDLE, Christopher, C. , ANDERSON, Jon, James , TU, Alex, Kuang-Hsuan , DHANDU, Siva, Sandeep
- 申请人： QUALCOMM Incorporated
- 申请人地址： International IP Administration 5775 Morehouse Drive San Diego, California 92121 US
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： International IP Administration 5775 Morehouse Drive San Diego, California 92121 US
- 代理机构： Carstens, Dirk Wilhelm
- 优先权： US55871 20080523; US470354 20090521
- 国际公布： WO2009143487 20091126
- 主分类号： G06F1/20
- IPC分类号： G06F1/20 ; H04W52/02 ; H04W28/16
摘要：
A data module operable in a wireless communication system is provided. The data module comprises a plurality of circuit components, one or more temperature sensors, and a thermal management unit. The temperature sensors are configured to determine the temperature of a corresponding circuit component. The thermal management unit is configured to determine one or more thermal characteristics of the data module based on the temperature determinations, and to generate one or more power control point signals indicating whether to adjust corresponding operating characteristics of a target component based on the determined thermal characteristics.
公开/授权文献
- EP2304518A2 THERMAL MANAGEMENT FOR DATA MODULES 公开/授权日：2011-04-06
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