THERMAL MANAGEMENT FOR DATA MODULES
    1.
    发明公开
    THERMAL MANAGEMENT FOR DATA MODULES 有权
    散热管理数据模块

    公开(公告)号:EP2304518A2

    公开(公告)日:2011-04-06

    申请号:EP09751715.5

    申请日:2009-05-22

    IPC分类号: G06F1/20

    摘要: A data module operable in a wireless communication system is provided. The data module comprises a plurality of circuit components, one or more temperature sensors, and a thermal management unit. The temperature sensors are configured to determine the temperature of a corresponding circuit component. The thermal management unit is configured to determine one or more thermal characteristics of the data module based on the temperature determinations, and to generate one or more power control point signals indicating whether to adjust corresponding operating characteristics of a target component based on the determined thermal characteristics.