发明授权
EP2305402B1 METHOD FOR PRODUCING SILVER-CONTAINING POWDER AND CONDUCTIVE PASTE USING THE SAME
有权
生产含银粉末的方法和使用该方法的导电糊剂
- 专利标题: METHOD FOR PRODUCING SILVER-CONTAINING POWDER AND CONDUCTIVE PASTE USING THE SAME
- 专利标题(中): 生产含银粉末的方法和使用该方法的导电糊剂
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申请号: EP09770019.9申请日: 2009-06-10
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公开(公告)号: EP2305402B1公开(公告)日: 2017-11-29
- 发明人: TAKAHASHI Akeo , KAWAMURA Kaori , LEE SeungTaeg , JIN Ren-Hua , MATSUKI Koichiro , KAJII Tomoyo
- 申请人: DIC Corporation
- 申请人地址: 35-58, Sakashita 3-chome Itabashi-ku Tokyo 174-8520 JP
- 专利权人: DIC Corporation
- 当前专利权人: DIC Corporation
- 当前专利权人地址: 35-58, Sakashita 3-chome Itabashi-ku Tokyo 174-8520 JP
- 代理机构: Maschio, Antonio
- 优先权: JP2008167262 20080626; JP2008288651 20081111; JP2009071732 20090324
- 国际公布: WO2009157309 20091230
- 主分类号: B22F9/24
- IPC分类号: B22F9/24 ; B22F1/00 ; B22F9/00 ; C09C1/62 ; C09C3/10 ; H01B1/22 ; H01B5/00 ; C22C5/06 ; C01G5/00 ; B82Y30/00
摘要:
The present invention relates to powder containing silver nanoparticles having an average particle size of 2 to 50 nm in an amount of 95% or more by mass and to applications of the powder. Silver-containing powder containing the silver nanoparticles is obtained by reducing a silver compound in the presence of a compound obtained by bonding polyethylene glycol to polyethyleneimine having a certain molecular weight and then by performing a concentration step and a drying step. A plastic substrate is obtained by directly applying a conductive paste that uses the powder on a plastic substrate and by performing drying.
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