发明公开
- 专利标题： Optical-semiconductor encapsulating material
- 专利标题（中）： 材料用于封装光学半导体
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申请号： EP10186703.4申请日： 2010-10-06
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公开(公告)号： EP2312625A3公开(公告)日： 2011-04-27
- 发明人: Fujioka, Kazuya , Matsuda, Hirokazu , Akazawa, Koji
- 申请人： Nitto Denko Corporation
- 申请人地址： 1-2, Shimohozumi 1-chome Ibaraki-shi Osaka 567-8680 JP
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： 1-2, Shimohozumi 1-chome Ibaraki-shi Osaka 567-8680 JP
- 代理机构： Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权： JP2009233347 20091007
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; H01L23/31 ; H01L33/50 ; H01L33/56
摘要：
The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.
公开/授权文献
- EP2312625A2 Optical-semiconductor encapsulating material 公开/授权日：2011-04-20
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