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1.发明公开Encapsulating sheet, producing method thereof, light emitting diode device, and producing method thereof 审中-公开封装，其制造方法，以及它们的LED器件的制造方法
公开(公告)号：EP2571067A3
公开(公告)日：2013-11-20
申请号：EP12184062.3
申请日：2012-09-12
发明人： Kondo, Takashi , Matsuda, Hirokazu , Kono, Hiroki
IPC分类号： H01L33/52 , H01L25/075 , H01L33/56 , H01L33/50
CPC分类号： H01L33/52 , H01L25/0753 , H01L33/507 , H01L33/56 , H01L2924/0002 , H01L2933/005 , H01L2933/0091 , Y10T29/49002 , H01L2924/00
摘要： An encapsulating sheet (1) includes an encapsulating layer (2) for encapsulating a light emitting diode element (12), a light scattering layer (3) formed at one side in a thickness direction of the encapsulating layer (2) and for scattering light emitted from the light emitting diode element (12), and a spacer layer (4) interposed between the encapsulating layer (2) and the light scattering layer (3). The encapsulating sheet (1) may further include a phosphor layer (5) interposed between the encapsulating layer (2) and the spacer layer (4).
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公开(公告)号：EP2392607A2
公开(公告)日：2011-12-07
申请号：EP11168425.4
申请日：2011-06-01
CPC分类号： C08J3/243 , C08G77/12 , C08G77/16 , C08G77/20 , C08J2383/04 , C08K3/36 , C08K5/5425 , C08K5/5435 , C08L83/04 , C09D183/04 , Y10T428/2995 , Y10T428/31663 , C08L83/00
摘要： The present invention relates to a composition for a thermosetting silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an alkenyl group-containing silicon compound; (3) an epoxy group-containing silicon compound; (4) an organohydrogensiloxane; (5) a condensation catalyst; (6) a hydrosilylation catalyst; and (7) a silica particle, in which the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 µm, a content of particles having a particle size of 1 µm or less of 15% by number or less and a content of particles having a particle size of 60 urn or more of 15% by number or less.
摘要翻译： 本发明涉及用于热固性硅树脂的组合物，其包括：（1）在其末端具有硅烷醇基团的有机聚硅氧烷; （2）含烯基的硅化合物; （3）含环氧基的硅化合物; （4）有机氢硅氧烷; （5）缩合催化剂; （6）氢化硅烷化催化剂; （7）二氧化硅粒子，其中，（7）二氧化硅粒子的体积累积粒径为50〜50μm，粒径为1μm以下的粒子的含量为15个数％以下 粒径为60μm以上的粒子的含量为15个数％以下。
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公开(公告)号：EP2750210A2
公开(公告)日：2014-07-02
申请号：EP13197119.4
申请日：2013-12-13
发明人： Matsuda, Hirokazu , Ona, Haruka
CPC分类号： H01L33/52 , B29C43/18 , H01L33/56 , H01L2224/48091 , H01L2933/005 , Y10T428/265 , H01L2924/00014
摘要： An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element, a covering layer disposed at one side in a thickness direction with respect to the embedding layer, and a barrier layer interposed between the embedding layer and the covering layer; having a thickness of 50 µm or more and 1,000 µm or less; and for suppressing a transfer of a component contained in the covering layer to the embedding layer.
摘要翻译： 本发明提供一种封装光半导体元件的封装用片，其包括：埋入光半导体元件的埋入层;相对于埋入层在厚度方向的一侧配置的覆盖层;以及介于埋入层与 覆盖层; 具有50μm以上且1,000μm以下的厚度; 并用于抑制包含在覆盖层中的组分向嵌入层的转移。
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4.发明公开Encapsulating sheet, optical semiconductor device, and producing method thereof 审中-公开Verkapselungsblatt，光学半导体器件及其制造方法
公开(公告)号：EP2738826A3
公开(公告)日：2014-06-11
申请号：EP13194813.5
申请日：2013-11-28
发明人： Matsuda, Hirokazu , Ona, Haruka , Ooyabu, Yasunari
CPC分类号： H01L33/56 , C08G77/12 , C08G77/16 , C08G77/20 , C08L83/06 , C09D183/14 , H01L33/50 , H01L33/52 , H01L33/62 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/181 , H01L2933/005 , Y10T428/31663 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 µm or more.
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公开(公告)号：EP2312625A3
公开(公告)日：2011-04-27
申请号：EP10186703.4
申请日：2010-10-06
CPC分类号： H01L33/52 , H01L23/295 , H01L23/296 , H01L23/3135 , H01L33/507 , H01L2924/0002 , H01L2933/005 , H01L2933/0091 , H01L2924/00
摘要： The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.
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公开(公告)号：EP2312625A2
公开(公告)日：2011-04-20
申请号：EP10186703.4
申请日：2010-10-06
CPC分类号： H01L33/52 , H01L23/295 , H01L23/296 , H01L23/3135 , H01L33/507 , H01L2924/0002 , H01L2933/005 , H01L2933/0091 , H01L2924/00
摘要： The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.
摘要翻译： 片状光学半导体封装材料技术领域本发明涉及片状光学半导体封装材料，其包含：含有无机粒子的第一树脂层; 以及第二树脂层，其含有荧光体并且直接或间接地叠置在所述第一树脂层上，并且涉及用于光学半导体封装的套件，所述套件包括：片状成型体，其包括含有无机粒子的第一树脂层; 以及包含含有荧光体的第二树脂层的片状成形体。
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公开(公告)号：EP2750210A3
公开(公告)日：2014-12-24
申请号：EP13197119.4
申请日：2013-12-13
发明人： Matsuda, Hirokazu , Ona, Haruka
CPC分类号： H01L33/52 , B29C43/18 , H01L33/56 , H01L2224/48091 , H01L2933/005 , Y10T428/265 , H01L2924/00014
摘要： An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element, a covering layer disposed at one side in a thickness direction with respect to the embedding layer, and a barrier layer interposed between the embedding layer and the covering layer; having a thickness of 50 µm or more and 1,000 µm or less; and for suppressing a transfer of a component contained in the covering layer to the embedding layer.
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公开(公告)号：EP2535955A3
公开(公告)日：2014-03-12
申请号：EP12171629.4
申请日：2012-06-12
发明人： Matsuda, Hirokazu , Kondo, Takashi , Kono, Hiroki
CPC分类号： H01L33/507 , B29C43/18 , H01L33/505 , H01L33/54 , H01L33/56 , H01L2224/48091 , H01L2933/0041 , H01L2933/005 , Y10T428/269 , H01L2924/00014
摘要： An encapsulating sheet (1) includes an encapsulating resin layer (7) and a wavelength conversion layer (8) laminated on the encapsulating resin layer. The wavelength conversion layer is formed by laminating a barrier layer (6) formed of a light transmissive resin composition and having a thickness of 200 µm to 1000 µm, and a phosphor layer (5) containing a phosphor.
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9.发明公开Encapsulating sheet, light emitting diode device, and producing method thereof 审中-公开Verkapselungsschicht，lichtemittierende Diodenvorrichtung und korrespondierendes Herstellungsverfahren
公开(公告)号：EP2674993A2
公开(公告)日：2013-12-18
申请号：EP13171016.2
申请日：2013-06-07
发明人： Kono, Hiroki , Kondo, Takashi , Matsuda, Hirokazu
CPC分类号： H01L33/52 , H01L33/507 , H01L33/54 , H01L2924/0002 , H01L2933/0041 , H01L2933/005 , Y10T428/249921 , Y10T428/265 , H01L2924/00
摘要： An encapsulating sheet includes an encapsulating resin layer (2) and a barrier film layer (3) formed at one side in a thickness direction of the encapsulating resin layer. In addition a phosphor layer (4) can be at the side of the barrier layer (3).
摘要翻译： 封装片包括在封装树脂层的厚度方向的一侧形成的封装树脂层（2）和阻挡膜层（3）。 此外，磷光体层（4）可以在阻挡层（3）的侧面。
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公开(公告)号：EP2393134A3
公开(公告)日：2014-09-03
申请号：EP11168781.0
申请日：2011-06-06
发明人： Matsuda, Hirokazu , Suehiro, Ichiro
IPC分类号： H01L33/00 , H01L33/50 , H01L25/075
CPC分类号： H01L33/50 , H01L33/505 , H01L2224/48091 , H01L2933/0041 , H01L2933/005 , Y10T428/24752 , H01L2924/00014
摘要： The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer.
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