发明公开
- 专利标题： CYANIDE-FREE ELECTROLYTE FOR GALVANIC DEPOSITION OF GOLD OR ALLOYS THEREOF
- 专利标题（中）： 氰化物电解质黄金合金的电镀沉积
-
申请号： EP10724310.7申请日： 2010-06-09
-
公开(公告)号： EP2313541A1公开(公告)日： 2011-04-27
- 发明人: SCHMIDBAUR, Hubert , DUPRAT, Jean-Jacques , ROSSI, Davide , FALLETTA, Ester
- 申请人： COVENTYA S.p.A.
- 申请人地址： Via 1 Maggio, snc 22060 Carugo (CO) IT
- 专利权人： COVENTYA S.p.A.
- 当前专利权人： COVENTYA S.p.A.
- 当前专利权人地址： Via 1 Maggio, snc 22060 Carugo (CO) IT
- 代理机构： Pfenning, Meinig & Partner GbR
- 优先权： DE102009024396 20090609; US185789P 20090610
- 国际公布： WO2010142437 20101216
- 主分类号： C25D3/48
- IPC分类号： C25D3/48 ; C25D3/62
摘要：
The invention relates to a cyanide-free electrolyte for galvanic deposition of gold or alloys thereof, which has a neutral or alkaline aqueous solution of at least one gold complex and possibly of a complex of an alloy former for gold, the complexes being present in anionic form. The electrolyte according to the invention is used in galvanic deposition, in particular for coatings made of gold and alloys thereof.
公开/授权文献
信息查询
