发明公开
EP2419928A2 IMPROVED APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING
审中-公开
改进的装置FOR TEMPORARY与晶片接合-DEBONDING
- 专利标题： IMPROVED APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING
- 专利标题（中）： 改进的装置FOR TEMPORARY与晶片接合-DEBONDING
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申请号： EP10765211.7申请日： 2010-04-15
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公开(公告)号： EP2419928A2公开(公告)日： 2012-02-22
- 发明人: GEORGE, Gregory , JOHNSON, Hale , GORUN, Patrick , HUGHLETT, Emmett , HERMANOWSKI, James , STILES, Matthew , KUHNLE, Michael , PATRICIO, Dennis
- 申请人： Süss Microtec Lithography GmbH
- 申请人地址： Schleißheimer Str. 90 85748 Garching DE
- 专利权人： Süss Microtec Lithography GmbH
- 当前专利权人： Süss Microtec Lithography GmbH
- 当前专利权人地址： Schleißheimer Str. 90 85748 Garching DE
- 代理机构： Vossius & Partner
- 优先权： US169753P 20090416
- 国际公布： WO2010121068 20101021
- 主分类号： H01L21/68
- IPC分类号： H01L21/68
摘要：
An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.
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