公开(公告)号：EP2419928A2

公开(公告)日：2012-02-22

申请号：EP10765211.7

申请日：2010-04-15

申请人： Süss Microtec Lithography GmbH

发明人： GEORGE, Gregory ,  JOHNSON, Hale ,  GORUN, Patrick ,  HUGHLETT, Emmett ,  HERMANOWSKI, James ,  STILES, Matthew ,  KUHNLE, Michael ,  PATRICIO, Dennis

IPC分类号： H01L21/68

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

公开(公告)号：EP2409326A2

公开(公告)日：2012-01-25

申请号：EP10754021.3

申请日：2010-03-17

申请人： Süss Microtec Lithography GmbH

发明人： MOORE, John ,  HERMANOWSKI, James

IPC分类号： H01L23/12 ,  B81C1/00

CPC分类号： B29C35/08 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for fabricating a rigid temporary support used for supporting inorganic substrates during processing includes providing an inorganic substrate comprising a first surface to be processed and a second surface opposite to the first surface. Next, applying a liquid layer to the second surface of the inorganic substrate and then curing the applied liquid layer and thereby forming a rigid temporary support attached to the second surface of the inorganic substrate. Next, processing the first surface of the inorganic substrate while supporting the inorganic substrate upon the rigid temporary support. The curing includes first exposing the applied liquid layer to ultraviolet (UV) radiation and then performing a post exposure bake (PEB) at a temperature sufficient to complete the curing of the applied liquid layer and to promote outgassing of substances.

摘要翻译： 制造用于在加工过程中支撑无机基材的刚性临时支撑体的方法包括提供包括第一待加工表面和与第一表面相对的第二表面的无机基材。 接下来，将液体层施加到无机基板的第二表面，然后固化所施加的液体层，从而形成附着到无机基板的第二表面的刚性临时支撑。 接下来，在刚性临时支撑件上支撑无机基板的同时处理无机基板的第一表面。 固化包括首先将施加的液体层暴露于紫外线（UV）辐射，然后在足以完成施加的液体层的固化并促进物质的除气的温度下进行曝光后烘烤（PEB）。

公开(公告)号：EP2517237A2

公开(公告)日：2012-10-31

申请号：EP10840099.5

申请日：2010-12-22

申请人： Süss Microtec Lithography GmbH

发明人： HERMANOWSKI, James

IPC分类号： H01L21/683 ,  H01L21/304

CPC分类号： H01L21/67745 ,  H01L21/67132 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67748 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2924/30105 ,  Y10T156/1132 ,  Y10T156/15 ,  Y10T156/1944

摘要： An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

摘要翻译： 一种改进的用于剥离临时结合晶片的设备包括剥离器，清洁模块和贴带模块。 在去胶机中使用真空吸盘以保持脱粘的减薄晶片，并在清洁和安装到切割带上的后续处理步骤期间保留减薄的脱粘晶片。 在一个实施例中，脱粘的变薄晶片保持在真空吸盘上，并随真空吸盘一起移动到清洁模块中，然后移动贴带模块。 在另一个实施例中，剥离的变薄晶片保留在真空吸盘上，并且首先清洁模块在变薄晶片上移动以清洁晶片，然后贴带模块在变薄晶片上移动以将切割带安装到晶片上。