发明公开
- 专利标题: IMPROVEMENTS IN OR RELATING TO COOLING
- 专利标题(中): 改进技术或与之相关的冷却
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申请号: EP10770283.9申请日: 2010-04-28
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公开(公告)号: EP2425313A2公开(公告)日: 2012-03-07
- 发明人: TOZER, Robert , BASH, Cullen , PATEL, Chandrakant
- 申请人: Hewlett-Packard Development Company, L.P.
- 申请人地址: 11445 Compaq Center Drive West Houston, TX 77070 US
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: 11445 Compaq Center Drive West Houston, TX 77070 US
- 代理机构: Jennings, Vincent Louis
- 优先权: US432199 20090429
- 国际公布: WO2010127035 20101104
- 主分类号: G06F1/20
- IPC分类号: G06F1/20 ; H05K7/20
摘要:
According to one embodiment, an equipment enclosure (102a) includes a plurality of equipment elements (104a and 104b), each element having one or more heat generating sources. A heat exchanger (108a) is mounted towards the top of the equipment enclosure (102a). The heat exchanger (108a) is thermally coupled to at least some of the heat generating sources. The enclosure (102a) includes an exhaust vent (112) through which air heated by the heat exchanger (108a) may be evacuated, and an inlet vent (114) through which air from outside the equipment enclosure (102a) may be drawn into the equipment enclosure (102a) to cool the heat exchanger (108a) by stack effect ventilation.
公开/授权文献
- EP2425313B1 IMPROVEMENTS IN OR RELATING TO COOLING 公开/授权日:2024-10-30
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