公开(公告)号：EP2425312A2

公开(公告)日：2012-03-07

申请号：EP10770275.5

申请日：2010-04-28

申请人： Hewlett-Packard Development Company, L.P.

发明人： TOZER, Robert ,  BASH, Cullen ,  PATEL, Chandrakant

IPC分类号： G06F1/20 ,  H05K7/20

摘要： According to one embodiment, a data center comprises a first data center section comprising one or more equipment element elements. Each computer element has one or more heat generating sources. A second data center section comprises a heat exchanger, the second data center section being substantially segregated from the first section. A heat transfer element is thermally coupled to at least some of the heat generating sources and is further thermally coupled to the heat exchanger.

公开(公告)号：EP1627559B1

公开(公告)日：2011-05-11

申请号：EP04753796.4

申请日：2004-05-28

申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

发明人： BASH, Cullen ,  SHARMA, Ratnesh ,  PATEL, Chandrakant D.

IPC分类号： H05K7/20

CPC分类号： H05K7/20836 ,  F24F2221/40

摘要： A system (202) is provided for determining a re-circulation index value of airflow in a data center (100). The system (202) includes a controller (204) having a metrics module (216) configured to determine an index value of air re-circulation in one or more locations of the data center (100).

公开(公告)号：EP2425313A2

公开(公告)日：2012-03-07

申请号：EP10770283.9

申请日：2010-04-28

申请人： Hewlett-Packard Development Company, L.P.

发明人： TOZER, Robert ,  BASH, Cullen ,  PATEL, Chandrakant

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20818 ,  H05K7/20827

摘要： According to one embodiment, an equipment enclosure (102a) includes a plurality of equipment elements (104a and 104b), each element having one or more heat generating sources. A heat exchanger (108a) is mounted towards the top of the equipment enclosure (102a). The heat exchanger (108a) is thermally coupled to at least some of the heat generating sources. The enclosure (102a) includes an exhaust vent (112) through which air heated by the heat exchanger (108a) may be evacuated, and an inlet vent (114) through which air from outside the equipment enclosure (102a) may be drawn into the equipment enclosure (102a) to cool the heat exchanger (108a) by stack effect ventilation.

公开(公告)号：EP1627559A2

公开(公告)日：2006-02-22

申请号：EP04753796.4

申请日：2004-05-28

申请人： Hewlett-Packard Development Company, L.P.

发明人： BASH, Cullen ,  SHARMA, Ratnesh ,  PATEL, Chandrakant D.

IPC分类号： H05K7/20

CPC分类号： H05K7/20836 ,  F24F2221/40

摘要： A system (202) is provided for determining a re-circulation index value of airflow in a data center (100). The system (202) includes a controller (204) having a metrics module (216) configured to determine an index value of air re-circulation in one or more locations of the data center (100).

摘要翻译： 系统（202）被提供用于确定数据中心（100）中的气流的再循环指标值。 系统（202）包括具有被配置为确定数据中心（100）的一个或多个位置中的空气再循环的指标值的度量模块（216）的控制器（204）。