发明公开
- 专利标题： Photoresists comprising multi-amide component
- 专利标题（中）： Fotolacke mit Multi-Amid-Komponente
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申请号： EP11181122.0申请日： 2011-09-13
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公开(公告)号： EP2428842A1公开(公告)日： 2012-03-14
- 发明人: Prokopowicz, Gregory P. , Pohlers, Gerhard , Liu, Cong , Wu, Chunyi , Xu, Cheng-Bai , Oh, Joon Seok
- 申请人： Rohm and Haas Electronic Materials LLC
- 申请人地址： 455 Forest Street Marlborough, MA 01752 US
- 专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人地址： 455 Forest Street Marlborough, MA 01752 US
- 代理机构： Buckley, Guy Julian
- 优先权： US403413P 20100914
- 主分类号： G03F7/038
- IPC分类号： G03F7/038 ; G03F7/039
摘要：
New photoresist compositions are provided that comprise a component that comprises two or more amide groups. Preferred photoresists of the invention may comprise a resin with photoacid-labile groups; a photoacid generator compound; and a multi-amide component that can function to decrease undesired photogenrated-acid diffusion out of unexposed regions of a photoresist coating layer
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