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发明公开
EP2521173A2 Submount and method of manufacturing the same 审中-公开
基座及其制造方法

Submount and method of manufacturing the same
摘要：
A submount (40) comprises a submount substrate (32), a substrate protective layer (35) formed on the submount substrate (32), an electrode layer (33) formed on the substrate protective layer (35), and a solder layer (34) formed on the electrode layer (33). The carbon concentration in at least one of the region adjacent to an interface formed between said submount substrate (32) and said substrate protective layer (35), the region adjacent to an interface formed between said substrate protective layer (35) and said electrode layer (33) and the region adjacent to an interface formed between said electrode layer (33) and said solder layer (34) is not more than 1 x 10 20 atoms / cm 3 .
摘要（中）：

一种基座（40），包括基座基板（32），在基座基板（32）上形成的基板保护层（35），在基板保护层（35）上形成的电极层（33），以及焊料层 34）形成在电极层（33）上。 在与所述基座保护层（35）和所述基板保护层（35）之间形成的界面相邻的区域中的至少一个区域中的碳浓度，与在所述基板保护层（35）和所述电极层 （33）和与在所述电极层（33）和所述焊料层（34）之间形成的界面相邻的区域不大于1×1020原子/ cm3。

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