发明公开
- 专利标题： IMPROVED BIOCOMPATIBLE BONDING METHOD
- 专利标题（中）： 改进的生物相容性绑定过程
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申请号： EP11720231.7申请日： 2011-04-29
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公开(公告)号： EP2563464A2公开(公告)日： 2013-03-06
- 发明人: FARAJI, Boozarjomehr , ZHOU, David, Daomin , GREENBERG, Robert, J. , OK, Jerry , TALBOT, Neil, Hamilton , LITTLE, James, Singleton
- 申请人： Second Sight Medical Products, Inc.
- 申请人地址： 12744 San Fernando Road Building 3 Sylmar, CA 91342 US
- 专利权人： Second Sight Medical Products, Inc.
- 当前专利权人： Second Sight Medical Products, Inc.
- 当前专利权人地址： 12744 San Fernando Road Building 3 Sylmar, CA 91342 US
- 代理机构： Carter, Stephen John
- 优先权： US330089P 20100430; US330204P 20100430
- 国际公布： WO2011137298 20111103
- 主分类号： A61N1/36
- IPC分类号： A61N1/36 ; A61N1/375 ; H01L21/60 ; H01L21/56 ; A61B5/04
摘要：
The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as etching or applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.
公开/授权文献
- EP2563464B1 IMPROVED BIOCOMPATIBLE BONDING METHOD 公开/授权日：2018-06-06
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