发明公开
EP2567401A1 PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER
审中-公开
PROCEDURE FOR MINIMIZED SPAN教育在MEMS芯片上的晶片中的分离
- 专利标题： PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER
- 专利标题（中）： PROCEDURE FOR MINIMIZED SPAN教育在MEMS芯片上的晶片中的分离
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申请号： EP11778212.8申请日： 2011-05-03
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公开(公告)号： EP2567401A1公开(公告)日： 2013-03-13
- 发明人: HORTON, Roger , HUSSAIN, Javed
- 申请人： S3C, Inc.
- 申请人地址： 1296 Lawrence Station Road Suite 200 Sunnyvale, CA 94089 US
- 专利权人： S3C, Inc.
- 当前专利权人： S3C, Inc.
- 当前专利权人地址： 1296 Lawrence Station Road Suite 200 Sunnyvale, CA 94089 US
- 代理机构： Hart, Deborah Mary
- 优先权： US330767P 20100503
- 国际公布： WO2011140143 20111110
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.
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