发明公开
EP2577694A2 ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES
有权
连接和安装过渡和液相的电子元件的POLYMERLÖTPASTEN
- 专利标题： ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES
- 专利标题（中）： 连接和安装过渡和液相的电子元件的POLYMERLÖTPASTEN
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申请号： EP11787439.6申请日： 2011-05-26
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公开(公告)号： EP2577694A2公开(公告)日： 2013-04-10
- 发明人: MCCONNELL, James, E. , BULTITUDE, John , PHILLIPS, Reggie , HILL, Allen , RENNER, Garry, L. , LESSNER, Philip, M. , CHACKO, Antony, P. , BELL, Jeffrey , BROWN, Keith
- 申请人： Kemet Electronics Corporation
- 申请人地址： 2835 Kemet Way Simpsonville, SC 29681 US
- 专利权人： Kemet Electronics Corporation
- 当前专利权人： Kemet Electronics Corporation
- 当前专利权人地址： 2835 Kemet Way Simpsonville, SC 29681 US
- 代理机构： Goodman, Simon John Nye
- 优先权： US201113114126 20110524; US348318P 20100526
- 国际公布： WO2011150246 20111201
- 主分类号： H01G4/12
- IPC分类号： H01G4/12 ; H01G4/30 ; B23K31/02
摘要：
A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
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