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1.发明公开ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES 有权连接和安装过渡和液相的电子元件的POLYMERLÖTPASTEN
公开(公告)号：EP2577694A2
公开(公告)日：2013-04-10
申请号：EP11787439.6
申请日：2011-05-26
发明人： MCCONNELL, James, E. , BULTITUDE, John , PHILLIPS, Reggie , HILL, Allen , RENNER, Garry, L. , LESSNER, Philip, M. , CHACKO, Antony, P. , BELL, Jeffrey , BROWN, Keith
CPC分类号： H01G4/2325 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/3613 , B23K2201/42 , H01G4/005 , H01G4/30 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00
摘要： A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
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2.发明授权ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES 有权连接和安装过渡和液相的电子元件的POLYMERLÖTPASTEN
公开(公告)号：EP2577694B1
公开(公告)日：2016-03-16
申请号：EP11787439.6
申请日：2011-05-26
发明人： McCONNELL, John, E. , BULTITUDE, John , PHILLIPS, Reggie , HILL, Allen , RENNER, Garry, L. , LESSNER, Philip, M. , CHACKO, Antony, P. , BELL, Jeffrey , BROWN, Keith
CPC分类号： H01G4/2325 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/3613 , B23K2201/42 , H01G4/005 , H01G4/30 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00
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