Disclosed is a semiconductor device that comprises a plurality of through-silicon vias (TSVs), a signal line and a selective connector (1634-1, 1634-2, 1634-3, 1634-4) for causing the signal line to be either electrically connected to one of the TSVs or electrically isolated from all of the TSVs, based on a control signal (1654). Also disclosed is a semiconductor device with through-silicon vias (TSVs) that comprises a primary TSV group (1604), a plurality of signal lines connected to the primary TSV group, a redundant TSV group (1608) and connection circuitry (1620B) responsive to a control signal having a predetermined value to electrically connect the signal lines to the redundant TSV group (1608).