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发明公开
EP2586555A1 Modular wafering concept for wafering plant 审中-公开
Modulares WaferkonzeptfürWaferanlage

Modular wafering concept for wafering plant
摘要：
A wire saw device (100) for sawing a plurality of slices of a workpiece (10) is described. The wire saw device includes a wire guide assembly with at least two wire guide cylinders (122) for guiding a wire (20) to form at least one wire web with at least one working area, wherein the at least two wire guide cylinders (122) have a rotation axis, a first compartment (102), which houses the wire guide assembly and has a first side portion of the compartment, which is essentially parallel to the rotation axis, wherein the first compartment further comprises a second side portion of the compartment, which opposes the first side portion and which is essentially parallel to the rotation axis, a second compartment (104) housing a spool (116) for providing new wire, wherein the second compartment (104) is adjacent the first side portion.
摘要（中）：

描述了用于锯切工件（10）的多个切片的线锯装置（100）。 线锯装置包括线引导组件，其具有至少两个线引导筒（122），用于引导线（20）以形成具有至少一个工作区域的至少一个线幅，其中所述至少两个导线筒（122） ）具有旋转轴线，第一隔室（102），其容纳线引导组件并且具有基本上平行于旋转轴线的隔室的第一侧部分，其中第一隔室还包括第二侧部分 隔间，其与第一侧部分相对并且基本上平行于旋转轴线;第二隔室（104），其容纳用于提供新电线的线轴（116），其中第二隔室（104）与第一侧部相邻。

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