摘要:
A method for sawing an ingot, an ingot feeding system for a wire saw device and a wire saw including the ingot feeding system is described. The method for sawing an ingot includes feeding an ingot in a cutting direction towards a wire web of a wire saw while rotating the ingot around an axis of rotation, wherein the distance between the axis of rotation and the wire web is smaller than ± 10 mm, particularly ± 5 mm, particularly ± 2,5 mm.
摘要:
A pulley configured for a wire saw device having a wire forming a wire web is described. The pulley (400) includes a reception (414) which is configured for snap-lock engagement with a complementary engagement element, and a pull-element (430) connected to the pulley for releasing the snap-lock engagement by pulling.
摘要:
A wire saw device (200) for sawing a semiconductor work piece is provided. The wire saw device includes a spool reception arrangement (210) for receiving a spool (250), the spool including a spool flange (260; 270) at each end of the spool; and a sensor arrangement (220) for measuring the operation condition of at least one of the spool flanges (260; 270). Further, a method for measuring the operation condition of a wire saw device (200) for sawing a semiconductor work piece is described. The wire saw device includes a spool reception arrangement (210) for receiving a spool (250) including one flange (260; 270) at each end of the spool. The method includes measuring the operation condition of at least one of the spool flanges by a sensor arrangement (220).
摘要:
A wire saw control system (1) for operating a wire saw (100) is provided. The wire saw is adapted for cutting a wafer (302, 304, 306, 308). The wire saw control system is configured to control the temperature of a wire (230) of a wire saw and includes a temperature sensor (20) for measuring the temperature of the wire; and a controller (25) for controlling at least one operating parameter of the wire saw based on the measured temperature. Measuring the temperature particularly includes measuring the temperature distribution. Furthermore, a method for controlling the temperature and for operating a wire saw is provided.
摘要:
A sawing element (10) for a saw is provided. The element (10) includes a core (30), and a continuous outer layer of diamond (20). A respective saw (60) and a method for producing the element (10) are also provided.
摘要:
A wire saw device for sawing a workpiece is described. The wire saw device includes a main frame for supporting a housing, wherein the housing includes a first housing portion and a second housing portion being separated from the first housing portion, and a first wire guide assembly with at least two first wire guide cylinders for guiding a first wire to form at least one first wire web with at least one first working area, wherein the first wire guide assembly is provided within the first housing portion, a second wire guide assembly with at least two second wire guide cylinders for guiding a second wire to form at least one second wire web with at least one second working area, wherein the second wire guide assembly provided within the second housing portion, wherein the first housing portion and the second housing portion are adapted for maintaining the first and the second wire guide assemblies independent from each other, a first wire management unit for guiding the first wire, and a second wire management unit for guiding the second wire.
摘要:
The present disclosure provides a wire monitoring system (100) for a wire saw device. The wire monitoring system (100) includes a sensor arrangement (110) configured to be positioned adjacent to a wire (22) of the wire saw device, wherein the sensor arrangement (110) is adapted to detect a bow of the wire (22), and wherein the sensor arrangement (110) includes at least one sensor configured to be moved during operation of the wire saw device.
摘要:
The present disclosure provides a wire monitoring system (100) for a wire saw device. The wire monitoring system (100) includes a sensor arrangement configured to detect a relative distance (24) between at least two wire portions (22) of a wire of the wire saw device.
摘要:
A carrier for a semiconductor ingot is configured for top-loading and side-loading of a semiconductor ingot. The carrier includes a holder which attaches to the semiconductor ingot and can be placed at the top of a container. A side member is movable between an open position for side-loading and a closed position. A processing apparatus may move the side member of the carrier between the open and closed positions, and is configured to load and unload the semiconductor ingot from the carrier by side-loading and side-unloading.
摘要:
A pulley configured for a wire saw device having a wire forming a wire web is described. The pulley includes a wheel portion (410) around the pulley axis (410a), and a wire guiding portion (455) radially outward of the wheel portion for guiding a wire. The radial stiffness of the wheel portion is lower than the stiffness of the wheel portion in direction of the pulley axis.