发明公开
EP2589571A1 POWDER, SINTERED BODY AND SPUTTERING TARGET, EACH CONTAINING ELEMENTS CU, IN, GA AND SE, AND METHOD FOR PRODUCING THE POWDER
审中-公开
粉，烧结体溅射靶，每个元素Cu，In，Ga和SE，及其制造方法粉末
- 专利标题： POWDER, SINTERED BODY AND SPUTTERING TARGET, EACH CONTAINING ELEMENTS CU, IN, GA AND SE, AND METHOD FOR PRODUCING THE POWDER
- 专利标题（中）： 粉，烧结体溅射靶，每个元素Cu，In，Ga和SE，及其制造方法粉末
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申请号： EP11800801.0申请日： 2011-06-27
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公开(公告)号： EP2589571A1公开(公告)日： 2013-05-08
- 发明人: EHIRA, Masaya , NAMBU, Akira , KASHIWAI, Shigeo , FUKUZUMI, Masafumi
- 申请人： Kobelco Research Institute , Inc. , Hyogo Prefecture
- 申请人地址： 1-5-1 Wakinohama-kaigan-dori Chuo-ku Kobe-shi Hyogo 651-0073 JP
- 专利权人： Kobelco Research Institute , Inc.,Hyogo Prefecture
- 当前专利权人： Kobelco Research Institute , Inc.,Hyogo Prefecture
- 当前专利权人地址： 1-5-1 Wakinohama-kaigan-dori Chuo-ku Kobe-shi Hyogo 651-0073 JP
- 代理机构： Müller-Boré & Partner Patentanwälte
- 优先权： JP2010147618 20100629
- 国际公布： WO2012002337 20120105
- 主分类号： C01B19/00
- IPC分类号： C01B19/00 ; B22F1/00 ; B22F9/08 ; C22C9/00 ; C22C28/00 ; C23C14/34
摘要：
The present invention provides a Cu-In-Ga-Se powder containing Cu, In, Ga and Se in which cracks do not occur during sintering or processing, and a sintered body and sputtering target, each using the same. The present invention relates to a powder containing Cu, In Ga and Se, which contains a Cu-In-Ga-Se compound and/or a Cu-In-Se compound in an amount of 60 mass% or more in total. The powder of the present invention preferably contains an In-Se compound in an amount of 20 mass% or less and/or a Cu-In compound in an amount of 20 mass% or less.
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