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发明公开
EP2617461A1 Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device 审中-公开
密封共烧导电铝衬底与铂经由有源可植入医疗设备填充

Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device
摘要：
A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
摘要（中）：

共烧密封馈通是附连到有源可植入医疗器件。 通过包括在包括至少96或99％的氧化铝的氧化铝介质基板的进料。 通孔A通过从体液侧到装置侧的氧化铝介质基板地设置。 基本上封闭的孔隙，和无玻璃料基本上纯的铂是填充通孔形成通过导电体液侧和装置侧之间填充铂内设置。 甲气密密封是铂和氧化铝填充电介质基片，worin气密密封件包括在氧化铝电介质基板和铂填充物之间的曲折和相互保形界面之间。

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