公开(公告)号：EP2617461A1

公开(公告)日：2013-07-24

申请号：EP13151536.3

申请日：2013-01-16

申请人： Greatbatch Ltd.

发明人： Tang, Xiaohong ,  Thieblot, William C. ,  Frysz, Christine A. ,  Seitz, Keith W. ,  Stevenson, Robert A. ,  Brendel, Richard L. ,  Marzano, Thomas ,  Woods, Jason ,  Frustaci, Dominick J. ,  Winn, Steven W.

IPC分类号： A61N1/375 ,  H01G9/10

CPC分类号： A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

摘要： A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

摘要翻译： 共烧密封馈通是附连到有源可植入医疗器件。 通过包括在包括至少96或99％的氧化铝的氧化铝介质基板的进料。 通孔A通过从体液侧到装置侧的氧化铝介质基板地设置。 基本上封闭的孔隙，和无玻璃料基本上纯的铂是填充通孔形成通过导电体液侧和装置侧之间填充铂内设置。 甲气密密封是铂和氧化铝填充电介质基片，worin气密密封件包括在氧化铝电介质基板和铂填充物之间的曲折和相互保形界面之间。

公开(公告)号：EP2636427B1

公开(公告)日：2019-02-27

申请号：EP13151537.1

申请日：2013-01-16

申请人： Greatbatch Ltd.

发明人： Marzano, Thomas ,  Seitz, Keith W. ,  Stevenson, Robert A. ,  Tang, Xiaohong ,  Thiebolt, William C. ,  Frysz, Christine A. ,  Brendel, Richard L. ,  Woods, Jason ,  Winn, Steven W. ,  Frustaci, Dominick J. ,  Truex, Buehl E. ,  Hickel, Donald

IPC分类号： A61N1/375 ,  B22F3/00 ,  H01L21/77 ,  H05K3/40

公开(公告)号：EP2636427A1

公开(公告)日：2013-09-11

申请号：EP13151537.1

申请日：2013-01-16

申请人： Greatbatch Ltd.

发明人： Marzano, Thomas ,  Seitz, Keith W. ,  Stevenson, Robert A. ,  Tang, Xiaohong ,  Thiebolt, William C. ,  Frysz, Christine A. ,  Brendel, Richard L. ,  Woods, Jason ,  Winn, Steven W. ,  Frustaci, Dominick J. ,  Truex, Buehl E. ,  Hickel, Donald

IPC分类号： A61N1/375 ,  B22F3/00 ,  H01L21/77 ,  H05K3/40

CPC分类号： A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

摘要： An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

摘要翻译： 在升高的进料通过可连接到顶部或有源可植入医疗设备的一侧。 馈通包括导电套箍和一个电介质基片。 介质基片被定义为包含在体液侧和导电套箍内设置一个装置侧。 介质基片包括导电套圈以上提出的体液侧升高部分基因的反弹。 通孔的至少一个是通过从体液一侧向装置侧电介质基片处理完毕。 导电填充的过孔形成气密密封和体液侧和装置侧之间的导电的至少一个内设置。 的导线连接的特征是在体液侧导电耦合到所述填充和设置成邻近所述电介质基板的升高部分。

公开(公告)号：EP2628504A1

公开(公告)日：2013-08-21

申请号：EP13151535.5

申请日：2013-01-16

申请人： Greatbatch Ltd.

发明人： Stevenson, Robert A. ,  Marzano, Thomas ,  Seitz, Keith W. ,  Winn, Steven W. ,  Frysz, Christine A. ,  Brendel, Richard L. ,  Woods, Jason ,  Frustaci, Dominick J. ,  Tang, Xiaohong ,  Thiebolt, William C.

IPC分类号： A61N1/375 ,  B22F3/00 ,  H01L21/77 ,  H05K3/40

CPC分类号： A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

摘要： A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

摘要翻译： 的共连接的气密馈通，馈通电容器，并且引线组件包括具有经由穿过电介质基片从体液侧设置一个装置侧孔的电介质基板。 导电填充经由形成气密密封内的设置，并且是体液侧和装置侧之间的导电。 馈通电容器被连接到电介质基片和包括电容器电介质基板，通孔未填充的电容器的金属化包括在内部，一组电容器有源电极板电耦合到上设置在外金属化内金属和一组电容器接地的 电极板电耦合到所述金属化外层。 导电引线通孔中的未填充电容器内设置。 一种电接头连接所述导电填充，电容器内部的金属化地连同电容器有源电极板和导电性的引线。