There are disclosed herein various implementations of a system-in-package with integrated socket. In one such implementation, the system-in-package (100) includes a first active die (110) having a first plurality of electrical connectors on a top surface of the first active die, an interposer (130) situated over the first active die, and a second active die (120) having a second plurality of electrical connectors on a bottom surface of the second active die. The interposer is configured to selectively couple at least one of the first plurality of electrical connectors to at least one of the second plurality of electrical connectors. In addition, a socket (160) encloses the first and second active dies and the interposer, the socket being electrically coupled to at least one of the first active die, the second active die, and the interposer.