发明公开
EP2664592A1 CUTTING METHOD FOR STRENGTHENED GLASS PLATE
审中-公开
SCHNEIDEVERFAHRENFÜRVERSTÄRKTEGLASPLATTEN
- 专利标题: CUTTING METHOD FOR STRENGTHENED GLASS PLATE
- 专利标题(中): SCHNEIDEVERFAHRENFÜRVERSTÄRKTEGLASPLATTEN
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申请号: EP12734331.7申请日: 2012-01-11
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公开(公告)号: EP2664592A1公开(公告)日: 2013-11-20
- 发明人: SAITO, Isao , KOIKE, Akio , IWANAGA, Yasunari , KOBAYASHI, Yusuke , IWASAKI, Tatsuya
- 申请人: Asahi Glass Company, Limited
- 申请人地址: 5-1, Marunouchi 1-chome Chiyoda-ku Tokyo 100-8405 JP
- 专利权人: Asahi Glass Company, Limited
- 当前专利权人: Asahi Glass Company, Limited
- 当前专利权人地址: 5-1, Marunouchi 1-chome Chiyoda-ku Tokyo 100-8405 JP
- 代理机构: Müller-Boré & Partner Patentanwälte
- 优先权: JP2011003496 20110111; JP2011190024 20110831
- 国际公布: WO2012096285 20120719
- 主分类号: C03B33/09
- IPC分类号: C03B33/09 ; B23K26/00 ; B23K26/14 ; B23K26/38
摘要:
A method of cutting a strengthened glass plate includes irradiating a laser beam 20 on a front surface 12 of a strengthened glass plate 10 and moving an irradiation area 22 of the laser beam 20 on the front surface 12 of the strengthened glass plate 10 to cut the strengthened glass plate 10 by causing a crack that penetrates the strengthened glass plate 10 in the thickness direction at the back of the irradiation area 22. By irradiating the laser beam 20 to the front surface 12 of the strengthened glass plate 10, the intermediate layer 17 at the irradiation area 22 is heated to a temperature less than or equal to an annealing point and the propagation of the crack is suppressed by generating a tensile stress less than the internal remaining tensile stress in the intermediate layer 17 or the compression stress at the center of the irradiation area 22.
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