发明公开
EP2692526A1 MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE
审中-公开
多层树脂板，中厚板树脂层压板，固化的多层树脂板及其制造方法，带金属膜和半导体器件多层树脂板
- 专利标题： MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 多层树脂板，中厚板树脂层压板，固化的多层树脂板及其制造方法，带金属膜和半导体器件多层树脂板
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申请号： EP12762807.1申请日： 2012-02-24
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公开(公告)号： EP2692526A1公开(公告)日： 2014-02-05
- 发明人: NISHIYAMA, Tomoo , KUWANO, Atsushi , SHIRASAKA, Toshiaki , AWANO, Yasuhiko
- 申请人： Hitachi Chemical Company, Ltd.
- 申请人地址： 9-2, Marunouchi 1-chome Chiyoda-ku Tokyo 100-6606 JP
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： 9-2, Marunouchi 1-chome Chiyoda-ku Tokyo 100-6606 JP
- 代理机构： HOFFMANN EITLE
- 优先权： JP2011071252 20110328
- 国际公布： WO2012132691 20121004
- 主分类号： B32B27/20
- IPC分类号： B32B27/20
摘要：
The invention provides a multilayer resin sheet that includes: a resin composition layer that includes a thermosetting resin and a filler; and an adhesive layer that is disposed on at least one surface of the resin composition layer, the adhesive layer having an arithmetic average surface roughness Ra of 1.5 µm or less at a surface that does not face the resin composition layer.
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