-
1.发明公开ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER 审中-公开HAFTZUSAMMENSETZUNG，FILMARTIGER HAFTSTOFF UND VERBINDUNGSSTRUKTURFÜREIN SCHALTELEMENT
公开(公告)号：EP2180026A1
公开(公告)日：2010-04-28
申请号：EP08791778.7
申请日：2008-07-29
IPC分类号： C09J133/08 , C09J4/00 , C09J7/00 , C09J9/02 , C09J151/04 , C09J183/10 , H01B1/22 , H01L21/60 , H05K1/14 , H05K3/32
CPC分类号： H05K3/323 , C08G77/442 , C08L83/00 , C09J133/04 , C09J183/10 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/32225 , H01L2224/83851 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/19042 , H05K2201/0212 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The adhesive composition of the invention contains (a) organic fine particles comprising at least one selected from the group consisting of alkyl (meth)acrylate ester-butadiene-styrene copolymer or complexes thereof, alkyl (meth)acrylate ester-silicone copolymer or complexes thereof and silicone-(meth)acrylic acid copolymer or complexes thereof.
摘要翻译： 本发明的粘合剂组合物含有（a）包含选自（甲基）丙烯酸烷基酯 - 丁二烯 - 苯乙烯共聚物或其络合物中的至少一种的有机细颗粒，（甲基）丙烯酸烷基酯 - 硅氧烷共聚物或其配合物 和（甲基）丙烯酸硅氧烷共聚物或其复合物。
-
公开(公告)号：EP2692759B1
公开(公告)日：2018-10-31
申请号：EP12762900.4
申请日：2012-03-28
发明人： NISHIYAMA, Tomoo , KUWANO, Atsushi , SHIRASAKA, Toshiaki , HARA, Naoki , YOSHIHARA, Kensuke , KATAGI, Hideyuki
IPC分类号： C08G59/62 , B32B15/092 , B32B27/38 , C08J5/18 , C08K3/38 , C08L63/00 , H01L23/373 , H05K1/03 , H05K7/20
CPC分类号： H01L33/641 , B32B15/092 , B32B27/20 , B32B27/38 , B32B27/42 , B32B2457/14 , B32B2457/20 , C08J5/18 , C08J2363/00 , C08K3/38 , C08K2003/385 , C08L61/06 , C08L63/00 , H01L23/3737 , H01L23/4334 , H01L23/473 , H01L24/29 , H01L24/33 , H01L2224/05169 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/48507 , H01L2224/73265 , H01L2224/85639 , H01L2224/85644 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 µm to less than 1 µm, from 1 µm to less than 10 µm, and from 10 µm to 100 µm, and the filler contains boron nitride particles having particle sizes of from 10 µm to 100 µm. In the general Formula (I), R 1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R 2 and R 3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.
-
3.发明公开RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN SHEET LAMINATE, CURED RESIN SHEET LAMINATE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR DEVICE, AND LED DEVICE 审中-公开树脂组合物，树脂片，固化树脂膜，树脂片层叠体，LAMINATE FROM用于制造固化树脂膜AND PROCESS，半导体装置及LED器件
公开(公告)号：EP2692759A1
公开(公告)日：2014-02-05
申请号：EP12762900.4
申请日：2012-03-28
发明人： NISHIYAMA, Tomoo , KUWANO, Atsushi , SHIRASAKA, Toshiaki , HARA, Naoki , YOSHIHARA, Kensuke , KATAGI, Hideyuki
IPC分类号： C08G59/62 , B32B15/092 , B32B27/38 , C08J5/18 , C08K3/38 , C08L63/00 , H01L23/373 , H05K1/03 , H05K7/20
CPC分类号： H01L33/641 , B32B15/092 , B32B27/20 , B32B27/38 , B32B27/42 , B32B2457/14 , B32B2457/20 , C08J5/18 , C08J2363/00 , C08K3/38 , C08K2003/385 , C08L61/06 , C08L63/00 , H01L23/3737 , H01L23/4334 , H01L23/473 , H01L24/29 , H01L24/33 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 µm to less than 1 µm, from 1 µm to less than 10 µm, and from 10 µm to 100 µm, and the filler contains boron nitride particles having particle sizes of from 10 µm to 100 µm. In the general Formula (I), R 1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R 2 and R 3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.
摘要翻译： 本发明提供的树脂组合物包含环氧树脂单体，包含具有由下述通式（I）表示的结构单元，和填料，化合物的酚醛清漆树脂，其中利用激光填料的粒度分布，测得的 衍射法，在从0点01微米的respectivement范围内具有峰至小于1微米，1微米至小于10微米，以及从10微米至100微米，并且所述填料包含具有从10微米到的粒径氮化硼颗粒 100微米。 在通式（I）中，R 1个darstellt烷基对芳基，或芳烷基。 每个R 2和R 3unabhängigdarstellt氢原子，烷基上的基团，芳基，或芳烷基的。 米darstellt从0到2的数; 且n为1 darstellt的数第七
-
4.发明公开ADHESIVE COMPOSITION, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER 审中-公开KLEBEMITTEL UND VERBINDUNGSKONSTRUKTIONFÜRKREISGLIED
公开(公告)号：EP2048209A1
公开(公告)日：2009-04-15
申请号：EP07767396.0
申请日：2007-06-22
发明人： IZAWA, Hiroyuki c/o Hitachi Chemical Company Ltd., , SHIRASAKA, Toshiaki , KUDOU, Sunao c/o Hitachi Chemical Company Ltd., , TOMIZAWA, Keiko c/o Hitachi Chemical Company Ltd., , KATOGI, Shigeki c/o Hitachi Chemical Company Ltd.,
IPC分类号： C09J4/00 , C09J129/14 , C09J133/00 , C09J167/00 , C09J171/10 , C09J175/04 , C09J179/08 , H01B1/22 , H01L21/60 , H05K1/03 , H05K3/32
CPC分类号： C09J175/04 , C08F290/06 , C08F290/061 , C08G18/4018 , C08G18/4238 , C08G18/4854 , C08G18/6674 , C08G18/672 , C08G2650/56 , C08K5/14 , C08L75/04 , C08L2666/20 , C09J4/06 , C09J167/00 , C09J171/00 , C09J175/16 , C09J179/08 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/83101 , H01L2224/8388 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/19042 , H05K3/323 , H05K2201/0129 , C08G18/44 , H01L2924/00
摘要： The adhesive composition of the invention comprises (a) a thermoplastic resin, (b) a radical polymerizing compound with one or more fluorene structures in the molecule, and (c) a radical polymerization initiator.
摘要翻译： 本发明的粘合剂组合物包含（a）热塑性树脂，（b）在分子中具有一个或多个芴结构的自由基聚合化合物，和（c）自由基聚合引发剂。
-
公开(公告)号：EP2692526B1
公开(公告)日：2020-10-28
申请号：EP12762807.1
申请日：2012-02-24
IPC分类号： B32B15/092 , H01L23/00 , C09J7/20 , B32B27/20
-
公开(公告)号：EP3403711A1
公开(公告)日：2018-11-21
申请号：EP18166309.7
申请日：2014-10-15
发明人： YOSHIKAWA, Kouhei , KANEEDA, Masato , NAKAMURA, Hidehiro , SHIRASAKA, Toshiaki , KITAMURA, Kenetsu , ENOMOTO, Kazuhiro
CPC分类号： B01D53/0438 , B01D53/02 , B01D53/0423 , B01D53/0462 , B01D2253/102 , B01D2253/104 , B01D2253/106 , B01D2253/108 , B01D2253/1122 , B01D2253/1124 , B01D2253/204 , B01D2253/25 , B01D2253/3425 , B01D2257/504 , B01D2259/40009 , B01D2259/40086 , B01D2259/40088 , B01D2259/4009 , B01J20/041 , B01J20/043 , B01J20/06 , B01J20/08 , B01J20/103 , B01J20/226 , B01J20/3433 , B01J20/3458 , C01B32/50 , Y02C10/04 , Y02C10/08 , Y02P20/152 , Y02P20/57
摘要： In the step of regenerating a carbon dioxide capturing material, the amount of a regeneration gas to be supplied to a carbon dioxide recovery column is reduced to offer higher energy efficiency and to shorten the time taken to perform the regeneration step. A carbon dioxide recovery apparatus includes a carbon dioxide sorbing column, a heating unit, and first, second, and third channels. The carbon dioxide sorbing column contains a carbon dioxide capturing material. The heating unit heats the carbon dioxide capturing material. A carbon-dioxide-containing gas is introduced via the first channel into the carbon dioxide sorbing column. The regeneration gas is introduced via the second channel into the carbon dioxide sorbing column. A gaseous mixture containing a gas desorbed from the carbon dioxide capturing material is recovered via the third channel. In the apparatus, the heating unit preheats the carbon dioxide capturing material, and then the regeneration gas is introduced into the carbon dioxide sorbing column to recover carbon dioxide from the carbon dioxide capturing material.
-
公开(公告)号：EP3287185A1
公开(公告)日：2018-02-28
申请号：EP16768266.5
申请日：2016-02-24
CPC分类号： B01D53/0438 , B01D53/04 , B01D53/12 , B01D2253/104 , B01D2253/106 , B01D2253/1124 , B01D2255/2065 , B01D2257/504 , B01D2258/06 , B01D2259/40096 , B01D2259/40098 , B01D2259/4508 , B01D2259/4566 , B01J20/06 , B01J20/3433 , B01J20/3483 , Y02C10/08
摘要： Disclosed is a CO 2 concentration reducing device for separating and removing CO 2 from a gas containing CO 2 with a CO 2 adsorbent, the CO 2 concentration reducing device including: an adsorbent container which contains the CO 2 adsorbent; and a heating unit which heats the CO 2 adsorbent by an induction heating or a dielectric heating. Thus, a ventilation quantity can be reduced when CO 2 accumulated in a room is removed, and an electric power required for the ventilation and the electric power required for air conditioning can be reduced.
摘要翻译： 本发明提供一种CO2浓度降低装置，其利用CO2吸附剂从含有CO2的气体中分离除去CO2，其特征在于，具备：含有CO2吸附剂的吸附剂容器; 以及通过感应加热或电介质加热来加热CO 2吸附剂的加热单元。 因此，当室内积累的二氧化碳被去除时，可以减少通风量，并且可以减少通风所需的电力和空调所需的电力。
-
8.发明公开MULTILAYER RESIN SHEET, RESIN SHEET LAMINATE, CURED MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING SAME, MULTILAYER RESIN SHEET WITH METAL FOIL, AND SEMICONDUCTOR DEVICE 审中-公开多层树脂板，中厚板树脂层压板，固化的多层树脂板及其制造方法，带金属膜和半导体器件多层树脂板
公开(公告)号：EP2692526A1
公开(公告)日：2014-02-05
申请号：EP12762807.1
申请日：2012-02-24
IPC分类号： B32B27/20
摘要： The invention provides a multilayer resin sheet that includes: a resin composition layer that includes a thermosetting resin and a filler; and an adhesive layer that is disposed on at least one surface of the resin composition layer, the adhesive layer having an arithmetic average surface roughness Ra of 1.5 µm or less at a surface that does not face the resin composition layer.
摘要翻译： 本发明提供一种多层树脂片做，包括：树脂组合物层确实包括热固性树脂和填料; 和粘合剂层并在树脂组合物层的至少一个表面上设置，在表面具有1.5微米或更小的平均表面粗糙度Ra在算术粘合剂层没有不面对树脂组合物层。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.021 秒)
