发明公开
- 专利标题： Polishing apparatus and polishing method
- 专利标题（中）： 抛光装置和抛光方法
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申请号： EP13005371.3申请日： 2008-12-01
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公开(公告)号： EP2711128A3公开(公告)日： 2014-04-02
- 发明人: Takahashi, Tamami , Seki, Masaya , Kusa, Hiroaki , Yamaguchi, Kenji , Nakanishi, Masayuki
- 申请人： EBARA CORPORATION
- 申请人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo JP
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 当前专利权人地址： 11-1, Haneda Asahi-cho Ohta-ku, Tokyo JP
- 代理机构： Klang, Alexander H.
- 优先权： JP2007312724 20071203; JP2008292193 20081114
- 主分类号： B24B9/06
- IPC分类号： B24B9/06 ; B24B37/04 ; B24B21/00
摘要：
The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
公开/授权文献
- EP2711128B1 Polishing apparatus and polishing method 公开/授权日：2015-11-04
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