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    Polishing apparatus and polishing method
    4.
    发明公开
    Polishing apparatus and polishing method 有权
    抛光装置和抛光方法

    公开(公告)号：EP2711128A3

    公开(公告)日：2014-04-02

    申请号：EP13005371.3

    申请日：2008-12-01

    申请人： EBARA CORPORATION

    发明人： Takahashi, Tamami ,  Seki, Masaya ,  Kusa, Hiroaki ,  Yamaguchi, Kenji ,  Nakanishi, Masayuki

    IPC分类号： B24B9/06 ,  B24B37/04 ,  B24B21/00

    CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/008 ,  B24B21/20 ,  B24B27/0076 ,  B24B37/042 ,  B24B37/30 ,  B24B41/068 ,  B24B49/00 ,  Y10T428/24777

    摘要： The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

    摘要翻译： 本发明提供一种用于抛光基板周边的抛光设备。 该研磨装置具有：旋转保持机构，其使基板水平地保持并使基板旋转;多个研磨头组装体，其设置在基板的周围;多个带供给回收机构，其向多个研磨头组装体供给研磨带并回收研磨带 以及多个移动机构，所述多个移动机构构造成使所述多个抛光头组件在由所述旋转保持机构保持的所述基板的径向上移动。 带供给和回收机构位于多个抛光头组件的沿基片径向的外侧，并且带供给和回收机构被固定就位。

    POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
    5.
    发明公开
    POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 有权
    抛光装置和基板处理装置

    公开(公告)号：EP1719161A1

    公开(公告)日：2006-11-08

    申请号：EP05719731.1

    申请日：2005-02-23

    申请人： EBARA CORPORATION

    发明人： Hongo, Akihisa ,  Ito, Kenya ,  Yamaguchi, Kenji ,  Nakanishi, Masayuki

    IPC分类号： H01L21/304 ,  B24B9/00

    CPC分类号： B24B37/02 ,  B24B9/065 ,  B24B21/002

    摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

    摘要翻译： 抛光设备技术领域本发明涉及一种用于去除在基板的周边部分处产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光设备。 该研磨装置具备：在内部形成研磨室的壳体;保持基板并使其旋转的旋转台​​;向研磨室内供给研磨带并卷绕被供给至研磨用研磨带的研磨带的研磨带供给机构 室，用于将研磨带按压在基板的斜面部上的研磨头，用于向基板的表面和背面供给液体的液体供给装置，以及用于使研磨室的内压 被设定为低于抛光室的外部压力。

    POLISHING APPARATUS AND POLISHING METHOD
    6.
    发明公开
    POLISHING APPARATUS AND POLISHING METHOD 审中-公开
    抛光设备和抛光方法

    公开(公告)号：EP2990157A2

    公开(公告)日：2016-03-02

    申请号：EP15187259.5

    申请日：2008-12-01

    申请人： EBARA CORPORATION

    发明人： Takahashi, Tamami ,  Seki, Masaya ,  Kusa, Hiroaki ,  Yamaguchi, Kenji ,  Nakanishi, Masayuki

    IPC分类号： B24B9/06 ,  B24B37/04 ,  B24B21/00

    CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/008 ,  B24B21/20 ,  B24B27/0076 ,  B24B37/042 ,  B24B37/30 ,  B24B41/068 ,  B24B49/00 ,  Y10T428/24777

    摘要： The present invention provides a polishing apparatus for polishing a periphery of a substrate (W). This polishing apparatus includes a rotary holding mechanism (3) configured to hold the substrate (W) horizontally and rotate the substrate (W), plural polishing head assemblies (1A, 1B, 1C, 1D) provided around the substrate (W), plural tape supplying and recovering mechanisms (2A, 2B, 2C, 2D) configured to supply polishing tapes (23A, 23B, 23C) to the plural polishing head assemblies (1A, 1B, 1C, 1D) and recover the polishing tapes (23A, 23B, 23C) from the plural polishing head assemblies (1A, 1B, 1C, 1D), and plural moving mechanisms configured to move the plural polishing head assemblies (1A, 1B, 1C, 1D) in radial directions of the substrate (W) held by the rotary holding mechanism (3). The tape supplying and recovering mechanisms (2A, 2B, 2C, 2D) are located outwardly of the plural polishing head assemblies (1A, 1B, 1C, 1D) in the radial directions of the substrate (W), and the tape supplying and recovering mechanisms (2A, 2B, 2C, 2D) are fixed in position.

    摘要翻译： 本发明提供一种研磨装置，用于研磨基板（W）的周边。 该研磨装置具备：旋转保持机构（3），其使基板（W）水平地保持并使基板（W）旋转;多个研磨头组装体（1A，1B，1C，1D） （2A，2B，2C，2D），其被构造成向多个抛光头组件（1A，1B，1C，1D）供应抛光带（23A，23B，23C）并且回收抛光带（23A，23B （1A，1B，1C，1D）的多个研磨头组合体（1A，1B，1C，1D）中的多个研磨头组合体（1A，1B，1C，1D） 通过旋转保持机构（3）。 带供给和回收机构（2A，2B，2C，2D）位于多个研磨头组件（1A，1B，1C，1D）的沿基片（W）径向的外侧，并且带供给和回收 机构（2A，2B，2C，2D）固定就位。

    Polishing apparatus and polishing method
    9.
    发明公开
    Polishing apparatus and polishing method 有权
    Poliervorrichtung和Polierverfahren

    公开(公告)号：EP2067571A2

    公开(公告)日：2009-06-10

    申请号：EP08020811.9

    申请日：2008-12-01

    申请人： EBARA CORPORATION

    发明人： Takahashi, Tamami ,  Seki, Masaya ,  Kusa, Hiroaki ,  Yamaguchi, Kenji ,  Nakanishi, Masayuki

    IPC分类号： B24B9/06 ,  B24B37/04

    CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/008 ,  B24B21/20 ,  B24B27/0076 ,  B24B37/042 ,  B24B37/30 ,  B24B41/068 ,  B24B49/00 ,  Y10T428/24777

    摘要： The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

    摘要翻译： 本发明提供一种用于抛光基板周边的抛光装置。 该抛光装置包括：旋转保持机构，其被构造成水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成使多个研磨头组件沿着由旋转保持机构保持的基板的径向方向移动。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。