发明公开
- 专利标题： MODULAR ELECTRO-MECHANICAL DEVICE
- 专利标题（中）： 模块化机电装置
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申请号： EP11871259.5申请日： 2011-08-25
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公开(公告)号： EP2747947A1公开(公告)日： 2014-07-02
- 发明人: VAN DER LINDE, Benjamin Luke , SCRIMSHAW, David Leigh , CONNOR, Paul Francis , MILLER, Paul , EYERS, Ben , NETZLER, Sion , LASTMAN, Lucas
- 申请人： Demain Technology Pty Ltd.
- 申请人地址： Level 1 13 Corporate Drive Heatherton, VIC 3202 AU
- 专利权人： Demain Technology Pty Ltd.
- 当前专利权人： Demain Technology Pty Ltd.
- 当前专利权人地址： Level 1 13 Corporate Drive Heatherton, VIC 3202 AU
- 代理机构： Boult Wade Tennant
- 国际公布： WO2013026083 20130228
- 主分类号： B25F1/04
- IPC分类号： B25F1/04
摘要：
The invention relates to a connection for releasably connecting two parts of an electro-mechanical device, the connection including: a first connecting portion associated with a first part, and a second connecting portion associated with a second part, such that engagement of the first and second connecting portions imparts bias between the two parts, and a retention means suitable for maintaining the bias between the two parts.
信息查询
