发明授权
EP2751303B1 METHOD OF FORMING A THERMAL BARRIER COATING SYSTEM WITH ENGINEERED SURFACE ROUGHNESS
有权
形成具有工程表面粗糙度的热障涂层系统的方法
- 专利标题： METHOD OF FORMING A THERMAL BARRIER COATING SYSTEM WITH ENGINEERED SURFACE ROUGHNESS
- 专利标题（中）： 形成具有工程表面粗糙度的热障涂层系统的方法
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申请号： EP12758950.5申请日： 2012-08-30
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公开(公告)号： EP2751303B1公开(公告)日： 2018-03-28
- 发明人: BURNS, Andrew, J. , MERRILL, Gary, B. , PAULUS, John, R.
- 申请人： Siemens Energy, Inc. , Mikro Systems, Inc.
- 申请人地址： 4400 Alafaya Trail Orlando, FL 32826-2399 US
- 专利权人： Siemens Energy, Inc.,Mikro Systems, Inc.
- 当前专利权人： Siemens Energy, Inc.,Mikro Systems, Inc.
- 当前专利权人地址： 4400 Alafaya Trail Orlando, FL 32826-2399 US
- 代理机构： Maier, Daniel Oliver
- 优先权： US201113221077 20110830; US201113268101 20111007
- 国际公布： WO2013033323 20130307
- 主分类号： C23C24/08
- IPC分类号： C23C24/08 ; B22F3/22 ; B22F5/04 ; B22F7/02 ; B22F7/06 ; B22F5/00 ; C04B35/622 ; F01D25/00
摘要：
A method of manufacturing a substrate (16) with a ceramic thermal barrier coating (28, 32). The interface between layers of the coating contains an engineered surface roughness (12, 24) to enhance the mechanical integrity of the bond there between. The surface roughness is formed in a surface of a mold (10,20) and is infused by a subsequently cast layer of material (16, 28). The substrate may be partially sintered (76) prior to application of the coating layer(s) and the coated substrate and coating layer(s) may be co-sintered to form a fully coherent strain-free interlayer.
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