发明公开
- 专利标题: Power conversion apparatus
- 专利标题(中): 电力转换装置
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申请号: EP14171862.7申请日: 2012-07-25
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公开(公告)号: EP2782433A2公开(公告)日: 2014-09-24
- 发明人: Kuwano, Morio , Hara, Yosei , Hamada, Haruki
- 申请人: Hitachi Automotive Systems, Ltd.
- 申请人地址: 2520, Takaba Hitachinaka-shi Ibaraki 312-8503 JP
- 专利权人: Hitachi Automotive Systems, Ltd.
- 当前专利权人: Hitachi Automotive Systems, Ltd.
- 当前专利权人地址: 2520, Takaba Hitachinaka-shi Ibaraki 312-8503 JP
- 代理机构: MERH-IP Matias Erny Reichl Hoffmann
- 优先权: JP2011161533 20110725
- 主分类号: H05K7/14
- IPC分类号: H05K7/14 ; B60L11/14 ; H02M7/00 ; H05K7/20
摘要:
The invention relates to a
power conversion apparatus, comprising:
a power semiconductor module 300 that has a power semiconductor element to convert a direct current into an alternating current; a flow channel formation body 12 that forms a flow channel through which a cooling medium flows, wherein the power semiconductor module 300 has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion with the power semiconductor element therebetween, the flow channel formation body 12 has a top surface that faces the first heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween and a bottom surface that faces the second heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween, at the opposite side of the top surface with the power semiconductor module 300 therebetween, the flow channel formation body 12 is manufactured by a manufacturing method to cast a predetermined material in a mold, a surface of the side is a tapered surface 914 to facilitate separations with the mold, and surfaces of the top surface and the bottom surface having respectively an regular clearance 916 with respect to the first heat dissipation portion and the second heat dissipation portion.
power conversion apparatus, comprising:
a power semiconductor module 300 that has a power semiconductor element to convert a direct current into an alternating current; a flow channel formation body 12 that forms a flow channel through which a cooling medium flows, wherein the power semiconductor module 300 has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion with the power semiconductor element therebetween, the flow channel formation body 12 has a top surface that faces the first heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween and a bottom surface that faces the second heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween, at the opposite side of the top surface with the power semiconductor module 300 therebetween, the flow channel formation body 12 is manufactured by a manufacturing method to cast a predetermined material in a mold, a surface of the side is a tapered surface 914 to facilitate separations with the mold, and surfaces of the top surface and the bottom surface having respectively an regular clearance 916 with respect to the first heat dissipation portion and the second heat dissipation portion.
公开/授权文献
- EP2782433B1 Power conversion apparatus 公开/授权日:2019-03-06
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