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    Power conversion apparatus
    3.
    发明公开
    Power conversion apparatus 审中-公开
    电力转换装置

    公开(公告)号：EP2782433A2

    公开(公告)日：2014-09-24

    申请号：EP14171862.7

    申请日：2012-07-25

    申请人： Hitachi Automotive Systems, Ltd.

    发明人： Kuwano, Morio ,  Hara, Yosei ,  Hamada, Haruki

    IPC分类号： H05K7/14 ,  B60L11/14 ,  H02M7/00 ,  H05K7/20

    CPC分类号： H05K7/209 ,  B60L3/003 ,  B60L3/0061 ,  B60L11/005 ,  B60L11/14 ,  B60L15/007 ,  B60L15/2009 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/36 ,  B60L2240/423 ,  B60L2240/443 ,  B60L2240/525 ,  B60L2270/145 ,  H01L2224/33 ,  H01L2224/48247 ,  H01L2224/73265 ,  H02M7/003 ,  H05K7/1432 ,  H05K7/20218 ,  H05K7/2089 ,  H05K7/20927 ,  H05K7/20945 ,  Y02T10/642 ,  Y02T10/645 ,  Y02T10/70 ,  Y02T10/7022 ,  Y02T10/7077 ,  Y02T10/7241 ,  Y02T10/7275

    摘要： The invention relates to a
    power conversion apparatus, comprising:
    a power semiconductor module 300 that has a power semiconductor element to convert a direct current into an alternating current; a flow channel formation body 12 that forms a flow channel through which a cooling medium flows, wherein the power semiconductor module 300 has a first heat dissipation portion and a second heat dissipation portion facing the first heat dissipation portion with the power semiconductor element therebetween, the flow channel formation body 12 has a top surface that faces the first heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween and a bottom surface that faces the second heat dissipation portion of the power semiconductor module 300 with the flow channel therebetween, at the opposite side of the top surface with the power semiconductor module 300 therebetween, the flow channel formation body 12 is manufactured by a manufacturing method to cast a predetermined material in a mold, a surface of the side is a tapered surface 914 to facilitate separations with the mold, and surfaces of the top surface and the bottom surface having respectively an regular clearance 916 with respect to the first heat dissipation portion and the second heat dissipation portion.

    摘要翻译： 功率转换装置技术领域本发明涉及一种功率转换装置，其包括：功率半导体模块300，其具有将直流转换成交流的功率半导体元件; 流路形成体12，其形成冷却介质流动的流路;功率半导体模块300具有第一散热部和面对第一散热部并隔着功率半导体元件的第二散热部， 流路形成体12具有隔着流路与功率半导体模块300的第一散热部对置的上表面和隔着流路面对功率半导体模块300的第二散热部的下表面， 在与功率半导体模块300之间的上表面的相反侧，流路形成体12通过在模具中铸造规定的材料的制造方法来制造，其侧面为锥面914， 与模具以及顶面和底面的表面分别具有 相对于第一散热部分和第二散热部分的常规间隙916。