发明公开
EP2820672A2 WIRE ARRANGEMENT FOR AN ELECTRONIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME
审中-公开
导线装置的电子电路用和方法及其生产
- 专利标题: WIRE ARRANGEMENT FOR AN ELECTRONIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME
- 专利标题(中): 导线装置的电子电路用和方法及其生产
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申请号: EP13716403.4申请日: 2013-02-20
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公开(公告)号: EP2820672A2公开(公告)日: 2015-01-07
- 发明人: DEKKER, Ronald , HENNEKEN, Vincent Adrianus , MULDER, Marcel
- 申请人: Koninklijke Philips N.V.
- 申请人地址: High Tech Campus 5 5656 AE Eindhoven NL
- 专利权人: Koninklijke Philips N.V.
- 当前专利权人: Koninklijke Philips N.V.
- 当前专利权人地址: High Tech Campus 5 5656 AE Eindhoven NL
- 代理机构: Steffen, Thomas
- 优先权: US201261605265P 20120301
- 国际公布: WO2013128341 20130906
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L23/49 ; H01L23/485 ; H01L21/768 ; A61B1/00 ; A61B1/05 ; H01L29/06
摘要:
The present invention relates to an electronic circuit arrangement (10) comprising: a substrate (12) having a first surface (12a) and a second surface (12b), an electronic circuit, an electrical connection part (16) for providing an electrical connection to the electronic circuit and being arranged on the first surface (12a), and at least one electrical wire (18). The electrical wire (18) comprises at least one conductive core (20) and an isolation (22) surrounding the conductive core (20). An end portion (18a) of the electrical wire (18) is an isolation-free portion for allowing access to the conductive core (20), wherein the end portion (18a) of the electrical wire (18) is connected to the electrical connection part (16). At least one through-hole (24) extending from the first surface (12a) to the second surface (12b) is provided in the substrate (12), wherein the electrical wire (18) is arranged through the through-hole (24).
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