发明公开
EP2826799A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL COMPONENT
审中-公开
光敏树脂组合物,其固化产物和光学组分
- 专利标题: PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL COMPONENT
- 专利标题(中): 光敏树脂组合物,其固化产物和光学组分
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申请号: EP13760462.5申请日: 2013-03-12
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公开(公告)号: EP2826799A1公开(公告)日: 2015-01-21
- 发明人: SON, Tamaki , KUBO, Takashi , IWAHAMA, Takahiro
- 申请人: Daicel Corporation
- 申请人地址: 3-4-5, Umeda, Kita-ku, Osaka-shi, Osaka 530-0001 JP
- 专利权人: Daicel Corporation
- 当前专利权人: Daicel Corporation
- 当前专利权人地址: 3-4-5, Umeda, Kita-ku, Osaka-shi, Osaka 530-0001 JP
- 代理机构: Grünecker, Kinkeldey, Stockmair & Schwanhäusser
- 优先权: JP2012056353 20120313; JP2012276096 20121218; JP2013041259 20130301
- 国际公布: WO2013137227 20130919
- 主分类号: C08G59/24
- IPC分类号: C08G59/24 ; C08G65/08
摘要:
Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows:
(A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds;
(B) a hydroxyl-containing compound having a molecular weight of 500 or more;
(C) a photo-cationic polymerization initiator; and
(D) a light-shielding material.
(A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds;
(B) a hydroxyl-containing compound having a molecular weight of 500 or more;
(C) a photo-cationic polymerization initiator; and
(D) a light-shielding material.
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