公开(公告)号：EP4010397B1

公开(公告)日：2024-09-18

申请号：EP19836524.9

申请日：2019-12-12

IPC分类号： C08G59/06 ,  C08G59/08 ,  C08G59/24

CPC分类号： C08G59/066 ,  C08G59/08 ,  C08G59/24

公开(公告)号：EP4382548A2

公开(公告)日：2024-06-12

申请号：EP24171352.8

申请日：2013-02-06

申请人： SWIMC LLC

发明人： NIEDERST, Jeffrey ,  EVANS, Richard H. ,  ROMAGNOLI, Kevin ,  O'BRIEN, Robert M. ,  VON MAIER, Mark S. ,  KILLILEA, T. Howard

IPC分类号： C08G59/24

CPC分类号： C08L71/00 ,  C08G59/063 ,  C08G59/066 ,  C08G59/1444 ,  C08G59/245 ,  C08G2650/5620130101 ,  C09D171/00

摘要： The present invention relates to an article comprising: a packaging container, or a portion thereof, having: a metal substrate; a coating composition disposed on at least a portion of the substrate, the coating composition comprising: a polyether polymer that includes at least 25% by weight of aryl or heteroaryl groups and is substantially free of bound bisphenol monomer, or a diepoxide thereof, and includes one or more segments of the below Formula (II):

wherein: H denotes a hydrogen atom, if present, each R1, if present, is independently an atom or group having an atomic weight of at least 15 Daltons, v is 0 to 4, and wherein two or more R1 groups can join to form one or more cyclic groups, wherein the polyether polymer does not include any halogens.

公开(公告)号：EP3131965B1

公开(公告)日：2024-06-12

申请号：EP15779232.6

申请日：2015-04-14

IPC分类号： C08L63/02 ,  C08G59/06 ,  C08F4/04 ,  C09D163/02 ,  C08L71/00 ,  C09D171/00 ,  C08L71/10 ,  B65D25/14 ,  B65D1/12 ,  C08F220/18 ,  C09D5/08 ,  C08G59/24 ,  C08F283/10 ,  C08G59/62 ,  C08G59/68 ,  C09D163/00

CPC分类号： C08F4/04 ,  C08L71/00 ,  C08G2650/5620130101 ,  C09D171/00 ,  C08F212/08 ,  C08F220/1802

公开(公告)号：EP4001341B1

公开(公告)日：2024-03-27

申请号：EP20839844.6

申请日：2020-07-14

发明人： OSAKA, Takuya ,  SUZUKI, Hirose

IPC分类号： C08G59/68 ,  C08G59/24 ,  C08G59/32 ,  C08J5/24

公开(公告)号：EP3647367B1

公开(公告)日：2023-11-15

申请号：EP18825144.1

申请日：2018-06-20

发明人： OKUNAGA, Kenichi ,  TOJO, Yusuke ,  YOKOE, Makito ,  UMETSU, Hideyuki

IPC分类号： C08G59/24 ,  C08G59/32 ,  C08G63/183 ,  C08L67/02 ,  C08L63/00 ,  C08L101/06

公开(公告)号：EP3825376B1

公开(公告)日：2023-10-11

申请号：EP19840221.6

申请日：2019-07-25

发明人： KO, Min Jin ,  JUNG, Jae Ho ,  YU, Min A ,  KIM, Min Kyoun ,  CHO, Byung Kyu ,  LEE, Taek Yong ,  KIM, Dong Yong

IPC分类号： C09J163/00 ,  C08L75/04 ,  C08L63/00 ,  C08G59/22 ,  C08G59/24 ,  C08G59/40 ,  C08G59/68

公开(公告)号：EP4192898A1

公开(公告)日：2023-06-14

申请号：EP21853666.2

申请日：2021-07-29

申请人： Blue Cube IP LLC

发明人： SCHROETZ, Markus

IPC分类号： C08G59/56 ,  C08G59/50 ,  C08G59/24 ,  C08G59/30 ,  C08K5/42 ,  C08L63/04

公开(公告)号：EP4140737A1

公开(公告)日：2023-03-01

申请号：EP21822911.0

申请日：2021-06-08

申请人： Showa Denko Materials Co., Ltd.

发明人： NAKAZAWA Takashi ,  SAKAI Hiroyuki ,  FUKUI Masato ,  NARITOMI Kazuya ,  YAMAZAKI Tomoharu

IPC分类号： B32B27/00 ,  C08G59/24 ,  C09J9/02 ,  C09J201/00 ,  C09J7/38 ,  H05K1/14

摘要： Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. A thickness of the first adhesive layer is 5 µm or less.

公开(公告)号：EP4124629A1

公开(公告)日：2023-02-01

申请号：EP21188423.4

申请日：2021-07-29

申请人： Hilti Aktiengesellschaft

发明人： Kumru, Memet-Emin

IPC分类号： C08G59/22 ,  C08G59/24 ,  C08G59/62 ,  C08G59/68 ,  C08K3/013 ,  C08K3/04 ,  C08K3/08 ,  C08K3/20 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/40

摘要： A multi-component epoxy resin material, comprising: an epoxy resin component (A) comprising at least one hardenable epoxy resin, and a hardener component (B) comprising a hardening agent for the epoxy resin of component (A), wherein the multi-component epoxy resin material further comprises at least one filler, wherein the total amount of filler in the multi-component epoxy resin material is 20 to 55 wt.-%, based on the total weight of the multi-component epoxy resin material, and wherein at least 4 wt.-% of the filler, based on the total weight of filler in the multi-component epoxy resin material, is composed of a filler (F) selected from graphite, nitrides of B or Si, oxides of Ti, Zn, Ca, Mg or Fe, fly ash, sepiolithe, cement, glass powder, metal powder, Mg(OH) 2 and mixtures thereof. The present invention further relates to the use of the multi-component epoxy resin material for fixing anchoring elements in a hole or crevice in a building substrate, as well as to a method of fixing an anchoring element in a hole or crevice in a building substrate, comprising introducing the multi-component epoxy resin material and an anchoring element into the hole or crevice, and allowing the multi-component epoxy resin material to cure.

公开(公告)号：EP3702356B1

公开(公告)日：2023-01-11

申请号：EP18871251.7

申请日：2018-10-15

发明人： AOKI, Kazunori ,  OKUMURA, Naoto ,  KASHIWABARA, Takashi ,  ARAKI, Yusuke ,  OTSUKA, Akihito ,  KUMANO, Takeshi

IPC分类号： C07D407/14 ,  C08G59/24 ,  C08G65/18