发明公开
EP2833393A1 CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD USING CONDUCTIVE PASTE FOR DIE BONDING
审中-公开
导电膏芯片安装和芯片安装方法使用芯片安装导电膏
- 专利标题： CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD USING CONDUCTIVE PASTE FOR DIE BONDING
- 专利标题（中）： 导电膏芯片安装和芯片安装方法使用芯片安装导电膏
-
申请号： EP13767655.7申请日： 2013-03-21
-
公开(公告)号： EP2833393A1公开(公告)日： 2015-02-04
- 发明人: OGASHIWA, Toshinori , SHIOYA, Akikazu , MIYAIRI, Masayuki
- 申请人： Tanaka Kikinzoku Kogyo K.K.
- 申请人地址： 7-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 JP
- 专利权人： Tanaka Kikinzoku Kogyo K.K.
- 当前专利权人： Tanaka Kikinzoku Kogyo K.K.
- 当前专利权人地址： 7-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 JP
- 代理机构： Dey, Michael
- 优先权： JP2012075525 20120329
- 国际公布： WO2013146504 20131003
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01B1/00 ; H01B1/22
摘要：
The present invention provides a conductive paste for die bonding comprising a metal powder and an organic solvent, the metal powder comprising: one or more metal particles selected from a silver powder, a palladium powder, and a copper powder, the metal particles having a purity of 99.9% by mass or higher and an average particle size of 0.01 µm to 1.0 µm; and a coating layer made of gold covering at least part of the metal particles. The conductive paste according to the present invention can suppress the occurrence of defects such as voids in a bonded part when a semiconductor element or the like is die-bonded to a substrate.
信息查询
IPC分类:
