发明公开
EP2852644A1 A PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE CHEMICAL MECHANICAL POLISHING (CMP) OF III-V MATERIAL IN THE PRESENCE OF A CMP COMPOSITION COMPRISING A SPECIFIC NON-IONIC SURFACTANT
审中-公开
PROCESS用于产生具有化学机械抛光（CMP）的III-V材料的存在CMP组合物的半导体元件与特定的，非离子表面活性
- 专利标题： A PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE CHEMICAL MECHANICAL POLISHING (CMP) OF III-V MATERIAL IN THE PRESENCE OF A CMP COMPOSITION COMPRISING A SPECIFIC NON-IONIC SURFACTANT
- 专利标题（中）： PROCESS用于产生具有化学机械抛光（CMP）的III-V材料的存在CMP组合物的半导体元件与特定的，非离子表面活性
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申请号： EP13794728.9申请日： 2013-05-21
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公开(公告)号： EP2852644A1公开(公告)日： 2015-04-01
- 发明人: NOLLER, Bastian Marten , GILLOT, Christophe , FRANZ, Diana , LI, Yuzhuo
- 申请人： BASF SE
- 申请人地址： 67056 Ludwigshafen DE
- 专利权人： BASF SE
- 当前专利权人： BASF SE
- 当前专利权人地址： 67056 Ludwigshafen DE
- 优先权： US201261650502P 20120523
- 国际公布： WO2013175396 20131128
- 主分类号： C09G1/02
- IPC分类号： C09G1/02 ; H01L21/304 ; H01L21/306
摘要：
A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one lll-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one amphiphilic non-ionic surfactant having (b1) at least one hydrophobic group; and (b2) at least one hydrophilic group selected from the group consisting of polyoxyalkylene groups comprising (b22) oxyalkylene monomer units other than oxyethylene monomer units; and (M) an aqueous medium.
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