摘要:
A chemical-mechanical polishing ("CMP") composition (P) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of N-heterocyclic compound as corrosion inhibitor, (C) at least one type of a further corrosion inhibitor selected from the group consisting of: (C1) an acetylene alcohol, and (C2) a salt or an adduct of (C2a) an amine, and (C2b) a carboxylic acid comprising an amide moiety, (D) at least one type of an oxidizing agent, (E) at least one type of a complexing agent, and (F) an aqueous medium.
摘要:
Aqueous dispersion comprising cerium oxide and silicon dioxide, obtainable by first mixing a cerium oxide starting dispersion and a silicon dioxide starting dispersion while stirring, and then dispersing at a shear rate of 10000 to 30000 s -1 , wherein a) the cerium oxide starting dispersion - contains 0.5 to 30% by weight of cerium oxide particles as the solid phase, - has a d5o of the particle size distribution of 10 to 100 nm - and has a pH of 1 to 7, and b) the silicon dioxide starting dispersion - contains 0.1 to 30% by weight of colloidal silicon dioxide particles as the solid phase, has a d5o of the particle size distribution of 3 to 50 nm and has a pH of 6 to 11.5, d) with the proviso that the d5o of the particle size distribution of the cerium oxide particles is greater than that of the silicon dioxide particles, the cerium oxide/silicon dioxide weight ratio is >1 and the amount of cerium oxide starting dispersion is such that the zeta potential of the dispersion is negative.
摘要:
The present invention relates to copolymers which are obtainable from the free-radical copolymerization of at least (a) a monoethylenically unsaturated carboxylic acid having from 3 to 6 carbon atoms or its anhydride with (b) a reaction mixture comprising a component of the general structural formula (I) where R1, R2, R3, R4 are each independently H or C1-C4-alkyl, n and m are each independently an integer from 1 to 100 and R5 is H or methyl, to a process for preparing the inventive polymer and to its use as a scale inhibitor.
摘要:
The present invention relates to a method for preparing a tank mix, which comprises the step of contacting a pesticide formulation, water, and a tank mix adjuvant which comprises a carbonate of the formula (I); to a pesticide formulation comprising the tank mix adjuvant; to a method of controlling phytopathogenic fungi and/or undesired vegetation and/or undesired insect or mite attack and/or for regulating the growth of plants, wherein the tank mix or the pesticide formulation is allowed to act on the respective pests, their environment or the plants to be protected from the respective pest, on the soil and/or on undesired plants and/or the crop plants and/or their environment; and to a use of the tank mix adjuvant for increasing the efficacyl of a pesticide.
摘要:
A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one lll-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one amphiphilic non-ionic surfactant having (b1) at least one hydrophobic group; and (b2) at least one hydrophilic group selected from the group consisting of polyoxyalkylene groups comprising (b22) oxyalkylene monomer units other than oxyethylene monomer units; and (M) an aqueous medium.
摘要:
The present invention relates to a method for the production of a paraffin inhibitor formulation, comprising the following steps: (a) producing a mixture containing (i) a wax-like paraffin inhibitor component having a melting point of > 0ºC, (ii) an emulsifier component, and (iii) optionally water at a temperature in a first temperature range, wherein the first temperature range is higher than the melting point of the component (i), and wherein the optionally present water produces an w/o emulsion and has a weight proportion that is lower than the sum of the weight proportions of the components (i) and (ii); (b) adding water to the mixture, wherein after the water has been completely added an o/w emulsion is present; (c) cooling the o/w emulsion from step (b) to a temperature in a second temperature range, which is lower than the melting point of the component (i); and (d) optionally adding an organic solvent component (iv), which can be mixed at least partly with water and in which the paraffin inhibitor component is not soluble. The present invention further relates to formulations that can be obtained from a production method, and to the use and application for paraffin inhibitors/solidification point reduction of crude oil or crude oil raffinates.
摘要:
A process for the manufacture of semiconductor devices is provided. The process comprises the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a polymer comprising at least one N-heterocycle, and (M) an aqueous medium and whereas Q1 has a pH of from 1.5 to 4.5.
摘要:
An aqueous polishing composition comprising (A) at least one water-soluble or water-dispersible compound selected from the group consisting of N-substituted diazenium dioxides and N'-hydroxy-diazenium oxide salts; and (B) at least one type of abrasive particles; the use of the compounds (A) for manufacturing electrical, mechanical and optical devices and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.