Invention Grant
- Patent Title: LED device, method of manufacturing the same, and light-emitting apparatus
- Patent Title (中): LED装置，其制造方法以及发光装置
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Application No.: EP14180793.3Application Date: 2011-01-18
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Publication No.: EP2854187B1Publication Date: 2018-03-07
- Inventor: Kanno, Hideyuki
- Applicant: Japan Aviation Electronics Industry, Ltd.
- Applicant Address: 21-2, Dogenzaka 1-chome Shibuya-ku Tokyo 150-0043 JP
- Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee Address: 21-2, Dogenzaka 1-chome Shibuya-ku Tokyo 150-0043 JP
- Agency: Prüfer & Partner mbB Patentanwälte · Rechtsanwälte
- Priority: JP2010018719 20100129
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/64 ; H05K1/02 ; F21Y115/10 ; F21V7/05 ; F21Y101/00 ; H01L33/62 ; H05K3/32 ; H05K3/30 ; H01L25/075 ; F21Y103/33 ; F21V17/12 ; F21K9/90 ; F21Y105/10
Abstract:
The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact.
Public/Granted literature
- EP2854187A1 LED device, method of manufacturing the same, and light-emitting apparatus Public/Granted day:2015-04-01
Information query
IPC分类:
