发明公开
- 专利标题: CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME
- 专利标题(中): 电路板和电子设备提供相同
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申请号: EP13807421.6申请日: 2013-06-21
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公开(公告)号: EP2866534A1公开(公告)日: 2015-04-29
- 发明人: OHASHI,Yoshio , SHIKATA,Kunihide
- 申请人: Kyocera Corporation
- 申请人地址: 6, Takeda Tobadono-cho, Fushimi-ku Kyoto-shi, Kyoto-fu 612-8501 JP
- 专利权人: Kyocera Corporation
- 当前专利权人: Kyocera Corporation
- 当前专利权人地址: 6, Takeda Tobadono-cho, Fushimi-ku Kyoto-shi, Kyoto-fu 612-8501 JP
- 代理机构: Viering, Jentschura & Partner Patent- und Rechtsanwälte
- 优先权: JP2012140165 20120621
- 国际公布: WO2013191288 20131227
- 主分类号: H05K3/38
- IPC分类号: H05K3/38 ; H05K1/09 ; H05K3/12
摘要:
[Object] To provide a highly reliable circuit board which can be used for a long period of time and an electronic apparatus including this circuit board and an electronic component mounted thereon.
[Solution] The circuit board includes a ceramic sintered body (11) and a metal wiring layer (13) provided on at least one primary surface (11a) thereof with a glass layer (12) interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface (11a) of the ceramic sintered body (11) is viewed, the ratio of the length of an interface (15) between the glass layer (12) and the metal wiring layer (13) to a length (12a) of the glass layer (12) in a direction along the primary surface (11a) is 1.25 to 1.80. As a result, good heat dissipation characteristics can be obtained, and the metal wiring layer (13) is not likely to be peeled away from the ceramic sintered body (11) due to operation of an electronic component (21) and/or cooling/heating cycles performed by repeated on-off operations thereof, so that a highly reliable circuit board which can be used for a long period of time can be provided.
[Solution] The circuit board includes a ceramic sintered body (11) and a metal wiring layer (13) provided on at least one primary surface (11a) thereof with a glass layer (12) interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface (11a) of the ceramic sintered body (11) is viewed, the ratio of the length of an interface (15) between the glass layer (12) and the metal wiring layer (13) to a length (12a) of the glass layer (12) in a direction along the primary surface (11a) is 1.25 to 1.80. As a result, good heat dissipation characteristics can be obtained, and the metal wiring layer (13) is not likely to be peeled away from the ceramic sintered body (11) due to operation of an electronic component (21) and/or cooling/heating cycles performed by repeated on-off operations thereof, so that a highly reliable circuit board which can be used for a long period of time can be provided.
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