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公开(公告)号:EP4514074A1
公开(公告)日:2025-02-26
申请号:EP23192916.7
申请日:2023-08-23
Applicant: Heraeus Electronics GmbH & Co. KG
Inventor: Chang, Ming Hung , Stadnik, Alan Paul , Huang, Wei-Po , Reinstädt, Markus , Sternkiker, Christoph , Wu, Hui Hsien
Abstract: The present invention relates to method for for depositing an electrically conductive layer on a surface of a three-dimensional (3D) electronic assembly 10A, 10B, 10C comprising at least one electronic device 14 embedded in a solid polymer material 16. The method comprises the steps of (i) providing a 3D electronic assembly 10A, 10B, 10C, (ii) forming at least one flow barrier 18 in the surface of the solid polymer material 16 of the 3D electronic assembly 10A, 10B, 10C, and (iii) depositing an electrically conductive layer 20A, 20B, 20C on at least a portion of the surface of the solid polymer material 16, such that the electrically conductive layer 20A, 20B, 20C is at least partially delimited by the flow barrier 18. The present invention also relates to an associated 3D electronic assembly 10A, 10B, 10C.
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公开(公告)号:EP4511428A1
公开(公告)日:2025-02-26
申请号:EP23717644.1
申请日:2023-03-21
Applicant: REOPHOTONICS, LTD.
Inventor: ZENOU, Michael
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公开(公告)号:EP4501080A1
公开(公告)日:2025-02-05
申请号:EP23714078.5
申请日:2023-03-20
Applicant: TactoTek Oy
Inventor: BRÄYSY, Vinski , HEIKKINEN, Mikko , SIPPARI, Mikko , APILO, Pälvi , HÄNNINEN, Ilpo , YRJÄNÄ, Samuli , KORHONEN, Pasi , SALMI, Taneli
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公开(公告)号:EP3501829B1
公开(公告)日:2025-02-05
申请号:EP17210436.6
申请日:2017-12-22
Inventor: KIM, Jae Hyung , NOH, Jeong Kyu , LEE, Jae Hwan , LEE, Duk Young
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公开(公告)号:EP4364536B1
公开(公告)日:2025-01-29
申请号:EP21790901.9
申请日:2021-10-13
Inventor: SURARU, Sabin-Lucian , KÖLLNBERGER, Andreas
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公开(公告)号:EP4490986A1
公开(公告)日:2025-01-15
申请号:EP23720260.1
申请日:2023-04-14
Applicant: Siemens Aktiengesellschaft
Inventor: BLANK, Rene , ERDMANN, Michael , FRÜHAUF, Peter , HEIMANN, Matthias , NERRETER, Stefan , WORMUTH, Dirk
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公开(公告)号:EP4480706A1
公开(公告)日:2024-12-25
申请号:EP24182238.6
申请日:2024-06-14
Applicant: Illinois Tool Works Inc.
Inventor: LOSIEWICZ, William A. , MATTERO, Patsy A.
Abstract: An apparatus includes a frame, a unit coupled to the frame and configured to deposit material on the electronic substrate, and a substrate support assembly coupled to the frame. The substrate support assembly is configured to support the electronic substrate. The substrate support assembly includes a worktable and a fixed support secured to the worktable. The fixed support extends from a first edge of the worktable to a second edge of the worktable. The substrate assembly further includes an adjustable support releasably secured to the worktable. The adjustable support extends from the first edge to the second edge and spaced from the fixed support. The substrate assembly further includes at least one guide mechanism configured to releasably secure the adjustable support in place on the worktable.
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公开(公告)号:EP3928985B1
公开(公告)日:2024-09-18
申请号:EP21173772.1
申请日:2021-05-13
IPC: B41F15/18 , B41F15/08 , H01L21/677 , H01L21/68 , H05K3/12
CPC classification number: H05K3/1233 , B41F15/26 , B41F15/0881
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公开(公告)号:EP4429417A1
公开(公告)日:2024-09-11
申请号:EP23160473.7
申请日:2023-03-07
Inventor: ARUTINOV, Gari , HENDRIKS, Rob Jacob
CPC classification number: H05K3/1275 , H05K2203/10720130101 , H05K3/3485 , H05K2203/011320130101 , H05K2203/033820130101
Abstract: The invention is directed at a device (1) for depositing a printing material (16) on a substrate (5), the device comprising: an optically transmissive plate (2) comprising a first surface (3) and a second surface (4) opposite the first surface, wherein the first surface (3) provides an optical reception surface for receiving an optical radiation signal (10), and wherein the second surface (4) comprises at least one deposition cavity (15) configured for holding said printing material (16) prior to deposition thereof, wherein the first surface is configured for cooperating with an optical source (11) for receiving said optical radiation signal (10), and wherein the at least one deposition cavity (15) comprises one or more walls forming an interface between the at least one deposition cavity (15) and the transmissive plate (2), the one or more walls comprising a multilayer release stack (18), wherein the multilayer release stack comprises an optical absorption layer (25) and an impediment layer (26).
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公开(公告)号:EP3808563B1
公开(公告)日:2024-09-11
申请号:EP20200092.3
申请日:2020-10-05
CPC classification number: H05K3/1233 , B41F15/423 , B41F15/46 , B41F33/16 , B41F33/0009 , B41F33/0036 , H05K2203/013920130101
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