发明公开
- 专利标题： DICING DEVICE AND DICING METHOD
- 专利标题（中）： ZERTEILUNGSVORRICHTUNG UND ZERTEILUNGSVERFAHREN
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申请号： EP13803775.9申请日： 2013-06-14
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公开(公告)号： EP2879164A1公开(公告)日： 2015-06-03
- 发明人: WATANABE, Junji , FUJITA, Takashi
- 申请人： Tokyo Seimitsu Co., Ltd. , Watanabe, Junji
- 申请人地址： 2968-2, Ishikawa-machi Hachioji-shi Tokyo 192-8515 JP
- 专利权人： Tokyo Seimitsu Co., Ltd.,Watanabe, Junji
- 当前专利权人： Tokyo Seimitsu Co., Ltd.,Watanabe, Junji
- 当前专利权人地址： 2968-2, Ishikawa-machi Hachioji-shi Tokyo 192-8515 JP
- 代理机构： Grünecker Patent- und Rechtsanwälte PartG mbB
- 优先权： JP2012136060 20120615
- 国际公布： WO2013187510 20131219
- 主分类号： H01L21/301
- IPC分类号： H01L21/301 ; B24D3/00 ; B24D3/06 ; B24D5/12
摘要：
To stably perform cutting process even on a workpiece formed from a brittle material, in a ductile mode with high precision, without causing cracking and/or breaking in the workpiece. A dicing device (10) which performs cutting process on a workpiece (W) includes: a dicing blade (26) that is formed into a discoid shape from a diamond sintered body (80) formed by sintering diamond abrasive grains, and contains 80 % or more of the diamond abrasive grains; a spindle (rotating mechanism) (28) configured to rotate the dicing blade (26); and a movement mechanism configured to move the workpiece (W) relatively to the dicing blade (26) while forming a constant cut depth on the workpiece (W) by the dicing blade (26).
公开/授权文献
- EP2879164B1 DICING DEVICE AND DICING METHOD 公开/授权日：2017-09-13
信息查询
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