The invention relates to a system for producing end products by cutting flat blocks, in particular flat and hollow wafer blocks. The system (1) is equipped with a main cutting station (3) in which a contour cutting device (12) that cuts the blocks (B) by means of contour cuts is arranged transversely to a linear transport path, said transport path extending in the longitudinal direction of the system. A main conveying device (6) arranged along the transport path conveys the blocks (B) through the contour cutting device (12). The contour cutting device is equipped with at least one contour cutting module (13) which is provided with at least one cutting tool (14a) that can be moved back and forth in the transverse direction of the system and produces a contour cut in the blocks (B) passing through the contour cutting device (12) in the longitudinal direction of the system.