发明公开
- 专利标题： POLYIMIDE RESIN COMPOSITION
- 专利标题（中）： POLYIMIDHARZZUSAMMENSETZUNG
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申请号： EP13841197.0申请日： 2013-09-27
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公开(公告)号： EP2902446A1公开(公告)日： 2015-08-05
- 发明人: SUENAGA, Shuya , MATSUMARU, Teruhisa
- 申请人： Mitsubishi Gas Chemical Company, Inc.
- 申请人地址： 5-2, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8324 JP
- 专利权人： Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人： Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人地址： 5-2, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8324 JP
- 代理机构： Hoffmann Eitle
- 优先权： JP2012214324 20120927
- 国际公布： WO2014051050 20140403
- 主分类号： C08L79/08
- IPC分类号： C08L79/08 ; B32B15/088 ; B32B27/34 ; C08G73/10 ; C08K3/36
摘要：
Provided is a polyimide resin composition capable of forming a polyimide film which is excellent in transparency and heat resistance and has a low thermal linear expansion coefficient. The polyimide resin composition contains a polyimide resin produced by reacting (A) a tetracarboxylic dianhydride with (B) a diamine containing a phenolic hydroxyl group-containing diamine in an amount of from 5 to 100 mol% of the total diamine; and silica microparticles, in a ratio by mass of from 25/75 to 60/40.
公开/授权文献
- EP2902446B1 POLYIMIDE RESIN COMPOSITION 公开/授权日：2018-08-15
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