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    METHOD FOR MANUFACTURING TRANSPARENT, HEAT-RESISTANT GAS-BARRIER FILM
    3.
    发明公开
    METHOD FOR MANUFACTURING TRANSPARENT, HEAT-RESISTANT GAS-BARRIER FILM 有权
    VERFAHREN ZUR HERSTELLUNG EINER TRANSPARENTENHITZEBESTÄNDIGENGASSPERRFOLIE

    公开(公告)号：EP2777929A1

    公开(公告)日：2014-09-17

    申请号：EP12847483.0

    申请日：2012-11-08

    申请人： Mitsubishi Gas Chemical Company, Inc.

    发明人： SUENAGA, Shuya ,  MIKI, Yasushi

    IPC分类号： B32B9/00 ,  B32B18/00 ,  B32B27/34 ,  B32B37/00 ,  B32B38/00

    CPC分类号： B32B33/00 ,  B05D3/0254 ,  B05D2505/50 ,  B32B27/00 ,  B32B2037/243 ,  B32B2307/306 ,  B32B2307/412 ,  B32B2307/7242 ,  B32B2379/08 ,  C08J7/045 ,  C08J7/047 ,  C08J2379/08 ,  C08J2483/16 ,  C23C18/1208 ,  C23C18/1212

    摘要： The present invention provides a process for producing a transparent heat-resistant gas-barrier film capable of exhibiting a good gas-barrier property and maintaining good properties even after heat-treated at a temperature of 250°C or higher, in a simple manner at low costs without need of a large size facility and a number of steps. The process for producing a transparent heat-resistant gas-barrier film according to the present invention includes the steps of coating a polysilazane-containing solution onto at least one surface of a transparent polyimide film formed of a polyimide containing a specific repeated unit; and calcining the coated solution at a temperature of 180°C or higher to laminate a silicon oxide layer obtained by the calcination on the transparent polyimide film.

    摘要翻译： 本发明提供一种即使在250℃以上的温度下进行热处理后也能够显示出良好的阻气性和保持良好性能的透明耐热阻气膜的制造方法， 低成本，无需大型设施和多个步骤。 根据本发明的透明耐热阻气膜的制造方法包括以下步骤：将聚硅氮烷溶液涂布在由含有特定重复单元的聚酰亚胺形成的透明聚酰亚胺膜的至少一个表面上; 并在180℃或更高的温度下煅烧涂布的溶液，以将通过煅烧获得的氧化硅层层压在透明聚酰亚胺膜上。

    POLYIMIDE RESIN
    4.
    发明公开
    POLYIMIDE RESIN 审中-公开

    公开(公告)号：EP3453732A1

    公开(公告)日：2019-03-13

    申请号：EP17792754.8

    申请日：2017-05-01

    申请人： Mitsubishi Gas Chemical Company, Inc.

    发明人： ABIKO, Yohei ,  SUENAGA, Shuya ,  SEKIGUCHI, Shinji

    IPC分类号： C08G73/10

    摘要： A polyimide resin including a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine compound, wherein the structural unit A includes at least one of a structural unit (A-1) derived from a compound represented by the following formula (a-1), a structural unit (A-2) derived from a compound represented by the following formula (a-2), and a structural unit (A-3) derived from a compound represented by the following formula (a-3), the structural unit B comprises a structural unit (B-1) derived from a compound represented by the following formula (b-1), a proportion of the structural unit (B-1) in the structural unit B is 60 mol% or more, and the polyimide resin has a glass transition temperature of higher than 410°C:



    wherein X and Y in the formula (b-1) each independently are a hydrogen atom, a methyl group, a chlorine atom, or a fluorine atom.

    POLYIMIDE RESIN, POLYIMIDE RESIN COMPOSITION, AND POLYIMIDE FILM
    7.
    发明公开
    POLYIMIDE RESIN, POLYIMIDE RESIN COMPOSITION, AND POLYIMIDE FILM 审中-公开

    公开(公告)号：EP3453733A1

    公开(公告)日：2019-03-13

    申请号：EP17792762.1

    申请日：2017-05-01

    申请人： Mitsubishi Gas Chemical Company, Inc.

    发明人： ABIKO, Yohei ,  SUENAGA, Shuya ,  SEKIGUCHI, Shinji

    IPC分类号： C08G73/10 ,  C08K3/22 ,  C08L79/08

    摘要： The present invention is directed to a polyimide resin comprising a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein the structural unit A contains a structural unit (A-1) derived from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, and the structural unit B contains a structural unit derived from an aliphatic diamine, a polyimide resin composition comprising the polyimide resin and inorganic nanoparticles, and a polyimide film comprising the polyimide resin or the polyimide resin composition. Provided are a polyimide resin and a polyimide resin composition, each of which can form a film having not only a heat resistance, and colorlessness and transparency but also low water absorption properties, and a polyimide film.