发明公开
EP2913850A4 IMAGING DEVICE, ENDOSCOPE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
审中-公开
成像设备中，内窥镜，半导体元件及其制造方法的半导体元件，
- 专利标题： IMAGING DEVICE, ENDOSCOPE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题（中）： 成像设备中，内窥镜，半导体元件及其制造方法的半导体元件，
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申请号： EP13849748申请日： 2013-10-04
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公开(公告)号： EP2913850A4公开(公告)日： 2016-09-21
- 发明人: YOSHIDA KAZUHIRO , NAKAYAMA TAKASHI
- 申请人： OLYMPUS CORP
- 专利权人： OLYMPUS CORP
- 当前专利权人： OLYMPUS CORP
- 优先权： JP2012233984 2012-10-23; JP2012248676 2012-11-12
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H04N5/335
摘要：
An image pickup apparatus 1 includes: an image pickup device chip 10 that has junction terminals 12, which is connected with an image pickup unit 11, on a reverse surface 10SB; a cable 40 having lead wires 41 connected with the image pickup unit 11; and a wiring board 30 that includes junction electrodes 31 formed at a central portion 30M and joined to the junction terminals 12, terminal electrodes 32 formed at extending portions 30S1, 30S2 and connected with the lead wires 41, wirings 33 that connect the junction electrodes 31 and the terminal electrodes 32, and a heat transmission pattern 35 formed in a region where the junction electrodes 31, the terminal electrodes 32 and the wirings 33 are not formed, the extending portions30S1, 30S2 being bent and thereby the wiring board 30 being arranged within a projected plane of the image pickup device chip 10.
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