利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

12 条记录 (耗时 0.009 秒)

    METHOD OF MANUFACTURING IMAGE PICKUP DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    1.
    发明公开
    METHOD OF MANUFACTURING IMAGE PICKUP DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    方法生成图像记录设备及方法的半导体元件

    公开(公告)号：EP2858106A4

    公开(公告)日：2016-04-13

    申请号：EP13797870

    申请日：2013-04-04

    申请人： OLYMPUS CORP

    发明人： YOSHIDA KAZUHIRO ,  FUJIMORI NORIYUKI ,  IGARASHI TAKATOSHI

    IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/66 ,  H01L21/768 ,  H01L21/78 ,  H01L25/04 ,  H01L27/14 ,  H01L27/146

    CPC分类号： H01L25/042 ,  H01L21/56 ,  H01L21/76898 ,  H01L21/78 ,  H01L22/10 ,  H01L22/20 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for producing an image pickup apparatus 10 includes: a process of fabricating a plurality of image pickup chips 30 by cutting an image pickup chip substrate 30W where light receiving sections 31 and electrode pads 32 are formed on a first main face 30SA; a process of fabricating a joined wafer 40W by bonding the image pickup chips 30 to a glass wafer 20W; a process of filling a gap between the plurality of image pickup chips 30 with a sealing member 42; a process of machining the joined wafer 40W from a side of a second main face 30SB to reduce a thickness; a process of forming through-hole vias 33S in the image pickup chips 30; a process of forming an insulating layer 43 that covers the second main face 30SB of the image pickup chips 30, a surface of the sealing member 42, and a wall face of the through-hole vias 33S; a process of forming through-hole interconnections 33; a process of forming external connection electrodes 34, each of which is connected to each of the through-hole interconnections 33 on the second main face 30SB; and a process of cutting the joined wafer 40W.

    摘要翻译： 一种用于制造图像拾取装置10方法包括：制作的图像拾取芯片的多个流程30通过切割在光接收部分31和电极焊盘32上的第一主面30SA形成的图像拾取芯片基板30W; 通过结合所述图像拾取芯片30到玻璃晶片20W制造连接晶片40W的处理; 填充用密封部件42的图像拾取芯片30多元性之间的间隙的工序; 从第二主面30SB的一侧加工接合晶片40W，以减少厚度的处理; 形成通孔的通孔33S在图像拾取芯片30的处理; 绝缘层的形成的过程43那样覆盖所述第二主面的图像拾取芯片30的30SB，密封部件42的表面，和通孔的通孔33S的壁面; 形成通孔互连33的处理; 形成外部连接的过程电极34中，每个的全部，其连接到每个所述第二主面的30SB贯通布线33; 和切割所述结合晶片40W的处理。

    IMAGING DEVICE, ENDOSCOPE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    3.
    发明公开
    IMAGING DEVICE, ENDOSCOPE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    成像设备中，内窥镜，半导体元件及其制造方法的半导体元件，

    公开(公告)号：EP2913850A4

    公开(公告)日：2016-09-21

    申请号：EP13849748

    申请日：2013-10-04

    申请人： OLYMPUS CORP

    发明人： YOSHIDA KAZUHIRO ,  NAKAYAMA TAKASHI

    IPC分类号： H01L27/14 ,  H04N5/335

    CPC分类号： H01L27/1464 ,  A61B1/00071 ,  A61B1/0011 ,  A61B1/05 ,  A61B1/051 ,  A61B1/128 ,  H01L27/14636 ,  H01L27/14683 ,  H04N5/2253 ,  H04N2005/2255

    摘要： An image pickup apparatus 1 includes: an image pickup device chip 10 that has junction terminals 12, which is connected with an image pickup unit 11, on a reverse surface 10SB; a cable 40 having lead wires 41 connected with the image pickup unit 11; and a wiring board 30 that includes junction electrodes 31 formed at a central portion 30M and joined to the junction terminals 12, terminal electrodes 32 formed at extending portions 30S1, 30S2 and connected with the lead wires 41, wirings 33 that connect the junction electrodes 31 and the terminal electrodes 32, and a heat transmission pattern 35 formed in a region where the junction electrodes 31, the terminal electrodes 32 and the wirings 33 are not formed, the extending portions30S1, 30S2 being bent and thereby the wiring board 30 being arranged within a projected plane of the image pickup device chip 10.

    IMAGING DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    5.
    发明公开
    IMAGING DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
    方法为半导体部件成像设备和方法

    公开(公告)号：EP2858111A4

    公开(公告)日：2016-04-13

    申请号：EP13796612

    申请日：2013-04-04

    申请人： OLYMPUS CORP

    发明人： IGARASHI TAKATOSHI ,  FUJIMORI NORIYUKI ,  YOSHIDA KAZUHIRO

    IPC分类号： H01L27/14 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L25/04 ,  H01L27/146

    CPC分类号： H01L27/14698 ,  H01L23/3121 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/335 ,  H01L2924/00

    摘要： A method for producing an image pickup apparatus 10 includes: a process of cutting an image pickup chip substrate 30W where a plurality of light receiving sections 31 are formed on a first main face 30SA and electrode pads 32 are formed around each of the light receiving sections 31 to fabricate a plurality of image pickup chips 30; a process of bonding the first main face 30SA of image pickup chips 30 determined as non-defective products to a glass wafer 20W different from the image pickup chip substrate 30W in at least either size or shape via a transparent adhesive layer 41 to fabricate a joined wafer 40W; a process of filling a sealing member 42 among the plurality of image pickup chips 30 bonded to the joined wafer 40W; a machining process including a process of machining the joined wafer 40W to thin a thickness of the joined wafer 30W, from a second main face 30SB side to flatten a machining surface and a process of forming through-hole interconnections 33, each of which is connected to each of the electrode pads 32; a process of forming a plurality of external connection electrodes 34, each of which is connected to each of the electrode pads 32 via each of the through-hole interconnections 33, on the second main face 30SB; and a process of cutting and individualizing the joined wafer 40W.

    IMAGING DEVICE
    7.
    发明公开
    IMAGING DEVICE 审中-公开

    公开(公告)号：EP2719319A4

    公开(公告)日：2015-03-11

    申请号：EP12797267

    申请日：2012-06-01

    申请人： OLYMPUS CORP

    发明人： YOSHIDA KAZUHIRO

    IPC分类号： A61B1/04 ,  A61B1/00

    CPC分类号： H04N5/369 ,  A61B1/00163 ,  A61B1/051

    摘要： An image pickup apparatus includes: a solid-state image pickup device in which one surface of a substrate is partitioned into a light-receiving portion region in which a light-receiving portion is provided that generates an image pickup signal of a picked-up optical image of a subject, a circuit portion region in which a circuit portion is provided that performs signal processing of the image pickup signal generated by the light-receiving portion and generates a driving signal that drives the light-receiving portion, and a terminal portion region in which a plurality of terminals are provided that are used when inputting and outputting signals between the circuit portion and an external apparatus; and an objective optical portion having an objective lens unit including a unit main body equipped with an objective lens group for forming an optical image of the subject and a holding barrel in which the unit main body is fixedly installed, and a prism that bends an optical axis of the unit main body and guides the optical image that passes through the objective lens unit to the light-receiving portion of the solid-state image pickup device. The prism of the objective optical portion is disposed on the light-receiving portion region of the substrate, and the holding barrel included in the objective lens unit of the objective optical portion is disposed on the circuit portion region.