A copper alloy of the present invention contains 5.00 to 8.00 atomic percent of Zr and includes Cu and a Cu-Zr compound, and two phases of the Cu and the Cu-Zr compound form a mosaic-like structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 µm or less are dispersed. This copper alloy is formed by a manufacturing method including a sintering step of performing spark plasma sintering on a Cu-Zr binary system alloy powder at a temperature of 0.9Tm°C or less (Tm(°C): melting point of the alloy powder) by supply of direct-current pulse electricity, the Cu-Zr binary system alloy powder having an average grain diameter of 30 µm or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr. The Cu-Zr compound may include at least one of Cu 5 Zr, Cu 9 Zr 2 , and Cu 8 Zr 3 .